Patents by Inventor Arvind Parthasarathi

Arvind Parthasarathi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190342343
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Patent number: 10404748
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: September 3, 2019
    Assignee: Guidewire Software, Inc.
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Patent number: 10341376
    Abstract: Various embodiments of the present technology include methods of assessing risk of a cyber security failure in a computer network of an entity. Various embodiments also include automatically determining, based on the assessed risk, a change or a setting to at least one element of policy criteria of a cyber security policy, automatically recommending, based on the assessed risk, computer network changes to reduce the assessed risk, and providing one or more recommended computer network changes to reduce the assessed risk. Various embodiments further include enactment by the entity of at least one of the one or more of the recommended computer network changes to reduce the assessed risk to the entity, determining that the entity has enacted at least a portion of the recommended computer network changes, and in response, automatically reassessing the risk of a cyber security failure based on the enacted recommended computer network changes.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: July 2, 2019
    Assignee: Guidewire Software, Inc.
    Inventors: George Y. Ng, Arvind Parthasarathi
  • Patent number: 10291642
    Abstract: Various embodiments of the present technology include methods of assessing risk of a cyber security failure in a computer network of an entity. Various embodiments also include automatically determining, based on the assessed risk, a change or a setting to at least one element of policy criteria of a cyber security policy, automatically recommending, based on the assessed risk, computer network changes to reduce the assessed risk, and providing one or more recommended computer network changes to reduce the assessed risk. Various embodiments further include enactment by the entity of at least one of the one or more of the recommended computer network changes to reduce the assessed risk to the entity, determining that the entity has enacted at least a portion of the recommended computer network changes, and in response, automatically reassessing the risk of a cyber security failure based on the enacted recommended computer network changes.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: May 14, 2019
    Assignee: Guidewire Software, Inc.
    Inventors: George Y. Ng, Arvind Parthasarathi
  • Publication number: 20160294854
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 6, 2016
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Publication number: 20110010349
    Abstract: We have invented a method and device for enabling users of enterprise software products to create, publish, and share reviews of enterprise software products. This useful, concrete and tangible result is accomplished through a server-hosted website accessible through the Internet. There are unique challenges with creating and sharing reviews of enterprise software products (compared to other products), and our invention solves these problems using several new and innovative methods we created, which form the basis of this application. Using this website, users of enterprise software can create a review of a product they are using or deploying, and also view reviews created by other users about the enterprise software products they are interested in. With usage, this invention becomes a global repository of enterprise software product reviews and a resource for users worldwide to share opinions and experiences to help each other evaluate, select, buy, and use enterprise software products.
    Type: Application
    Filed: July 10, 2009
    Publication date: January 13, 2011
    Inventors: Jeffrey Gordon Ellingson, Arvind Parthasarathi, Padmanabha Vedam
  • Patent number: 6136460
    Abstract: A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing tin coating. Alternatively, the existing tin coating may be exposed to a chemical bath including the agent and later heated to reflow the tin coating and agent thereby incorporating the agent into the matrix of the tin coating.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: October 24, 2000
    Assignee: Olin Corporation
    Inventors: Szuchain Chen, Julius Fister, Dennis Brauer, Arvind Parthasarathi, Christopher Laurello
  • Patent number: 6083633
    Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: July 4, 2000
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Szuchain F. Chen, Christoper P. Laurello, Arvind Parthasarathi, Derek E. Tyler
  • Patent number: 5969414
    Abstract: There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.
    Type: Grant
    Filed: May 25, 1994
    Date of Patent: October 19, 1999
    Assignee: Advanced Technology Interconnect Incorporated
    Inventors: Arvind Parthasarathi, Deepak Mahulikar
  • Patent number: 5952083
    Abstract: Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: September 14, 1999
    Assignee: Advanced Technology Interconnect, Inc.
    Inventors: Arvind Parthasarathi, Satish Jalota, Jeffrey Schlater, Lynn Strauman, Jeffrey S. Braden
  • Patent number: 5817544
    Abstract: A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires. The package adhesion enhancing layer is from the group consisting essentially of aluminum oxide, anti-tarnish finishes, and dielectrics.The exposed layer on the leadframe is selected from the group consisting essentially of silver, nickel, palladium.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: October 6, 1998
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 5688606
    Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.
    Type: Grant
    Filed: April 18, 1996
    Date of Patent: November 18, 1997
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes, Jeffrey M. Schlater, German J. Ramirez, Dexin Liang
  • Patent number: 5650663
    Abstract: An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.
    Type: Grant
    Filed: July 3, 1995
    Date of Patent: July 22, 1997
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 5578869
    Abstract: There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
    Type: Grant
    Filed: March 29, 1994
    Date of Patent: November 26, 1996
    Assignee: Olin Corporation
    Inventors: Paul R. Hoffman, Deepak Mahulikar, George A. Brathwaite, Dawit Solomon, Arvind Parthasarathi
  • Patent number: 5573845
    Abstract: There is provided a composite material particularly suited for electrical and electronic applications having a metallic core with a desired surface finish. An acicular superficial coating layer having an apparent thickness of less than 275 angstroms is adjacent to at least a portion of the metallic core. The superficial coating layer is removable from the metallic core without appreciable change to the metallic core surface finish.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: November 12, 1996
    Assignee: Olin Corporation
    Inventors: Arvind Parthasarathi, William L. Brenneman
  • Patent number: 5563442
    Abstract: There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: October 8, 1996
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Arvind Parthasarathi
  • Patent number: 5540378
    Abstract: There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: July 30, 1996
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Arvind Parthasarathi
  • Patent number: 5534356
    Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: July 9, 1996
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes, Jeffrey M. Schlater, German J. Ramirez, Dexin Liang
  • Patent number: 5489373
    Abstract: There is disclosed an aqueous chemical solution that consists essentially of zinc ions, a source of hydroxides, and silicon ions. The ratio of silicon to zinc (Si:Zn) is, by weight from about 1:5 to about 1:250. Within the ratio range, the silicon ions inhibit precipitation of zinc from the chemical solution. This is particularly useful when the chemical solution is an electrolyte for the deposition of zinc or a zinc containing compound onto a metallic structure where a critical zinc content must be maintained to impart adequate adhesion of a coated substrate to a polymer adhesive.
    Type: Grant
    Filed: February 2, 1995
    Date of Patent: February 6, 1996
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 5449951
    Abstract: There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: September 12, 1995
    Assignee: Olin Corporation
    Inventors: Arvind Parthasarathi, Deepak Mahulikar