Patents by Inventor Arvind Parthasarathi

Arvind Parthasarathi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230421567
    Abstract: Systems for tracking incident data across phases of a data incident response including analysis, containment, and recovery, and automatically generating data incident reports are disclosed herein. Embodiments enable viewing of all the incident data in a single place including tracking of origin and history of the incident data to create an audit trail. Embodiments include managing incident data sharing and reporting including automatically generating and sharing data incident reports. Embodiments include a first feedback loop and a second feedback loop. The first feedback loop includes automatically surfacing to users changes to incident report specifications, errors or warnings in incident data with resolving recommendations including specific tasks to resolve the errors or warnings.
    Type: Application
    Filed: September 7, 2023
    Publication date: December 28, 2023
    Inventors: Kevin Gaffney, Paul Meagher, Marlon Rodrigues, Jordan McGrath, Omar Anshasi, Steve Qian, Yuli Mitsner, Biwei Tan, Arvind Parthasarathi
  • Publication number: 20230412611
    Abstract: Systems for tracking incident data across phases of a data incident response including analysis, containment, and recovery, and automatically generating data incident reports are disclosed herein. Embodiments enable viewing of all the incident data in a single place including tracking of origin and history of the incident data to create an audit trail. Embodiments include managing incident data sharing and reporting including automatically generating and sharing data incident reports. Embodiments include a first feedback loop and a second feedback loop. The first feedback loop includes automatically surfacing to users changes to incident report specifications, errors or warnings in incident data with resolving recommendations including specific tasks to resolve the errors or warnings.
    Type: Application
    Filed: September 5, 2023
    Publication date: December 21, 2023
    Inventors: Kevin Gaffney, Paul Meagher, Marlon Rodrigues, Jordan McGrath, Omar Anshasi, Steve Qian, Yuli Mitsner, Biwei Tan, Arvind Parthasarathi
  • Patent number: 11526825
    Abstract: Cloud-based multi-tenancy computing systems and methods for providing response control and analytics are disclosed. An exemplary method includes capturing a first set of data based on activities that occur in the activated response center related to the client's actions taken in response to the event; generating a first set of analytics based on the captured first set of data; capturing a second set of data based on activities that occur in a plurality of response centers of client tenants related to the clients' actions taken in response to the events that occurred to them; generating a second set of analytics based on the captured second set of data; and based on the first and second set of analytics produced by the response system, generating and transmitting an updated menu of suggested actions for responding to a future event, to one or more of the clients.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: December 13, 2022
    Assignee: Cygnvs Inc.
    Inventors: Sai Avala, Darragh Buffini, Kevin Gaffney, Arvind Parthasarathi
  • Publication number: 20220255965
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Application
    Filed: January 27, 2022
    Publication date: August 11, 2022
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Patent number: 11265350
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 1, 2022
    Assignee: Guidewire Software, Inc.
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Publication number: 20220027828
    Abstract: Cloud-based multi-tenancy computing systems and methods for providing response control and analytics are disclosed.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 27, 2022
    Inventors: Sai Avala, Darragh Buffini, Kevin Gaffney, Arvind Parthasarathi
  • Publication number: 20190342343
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Patent number: 10404748
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: September 3, 2019
    Assignee: Guidewire Software, Inc.
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Patent number: 10341376
    Abstract: Various embodiments of the present technology include methods of assessing risk of a cyber security failure in a computer network of an entity. Various embodiments also include automatically determining, based on the assessed risk, a change or a setting to at least one element of policy criteria of a cyber security policy, automatically recommending, based on the assessed risk, computer network changes to reduce the assessed risk, and providing one or more recommended computer network changes to reduce the assessed risk. Various embodiments further include enactment by the entity of at least one of the one or more of the recommended computer network changes to reduce the assessed risk to the entity, determining that the entity has enacted at least a portion of the recommended computer network changes, and in response, automatically reassessing the risk of a cyber security failure based on the enacted recommended computer network changes.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: July 2, 2019
    Assignee: Guidewire Software, Inc.
    Inventors: George Y. Ng, Arvind Parthasarathi
  • Patent number: 10291642
    Abstract: Various embodiments of the present technology include methods of assessing risk of a cyber security failure in a computer network of an entity. Various embodiments also include automatically determining, based on the assessed risk, a change or a setting to at least one element of policy criteria of a cyber security policy, automatically recommending, based on the assessed risk, computer network changes to reduce the assessed risk, and providing one or more recommended computer network changes to reduce the assessed risk. Various embodiments further include enactment by the entity of at least one of the one or more of the recommended computer network changes to reduce the assessed risk to the entity, determining that the entity has enacted at least a portion of the recommended computer network changes, and in response, automatically reassessing the risk of a cyber security failure based on the enacted recommended computer network changes.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: May 14, 2019
    Assignee: Guidewire Software, Inc.
    Inventors: George Y. Ng, Arvind Parthasarathi
  • Publication number: 20160294854
    Abstract: Systems and methods for cyber risk analysis and remediation using network monitored sensors are provided herein. An example system includes one or more data collecting devices deployed within a network that collect entity information and monitor network traffic of the network that is related to security information. The network includes computing systems that are subject to a cyber risk policy having breach parameters defining one or more events that are indicative of a cyber security breach. A cyber security risk assessment and management system is used to automatically detect occurrence of one or more of the events that are indicative of a cyber security breach, automatically determine the breach parameters that apply for the one or more events that occurred, and generates a remediation of cyber security parameters for the network.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 6, 2016
    Inventors: Arvind Parthasarathi, George Y. Ng, Matthew Honea
  • Publication number: 20110010349
    Abstract: We have invented a method and device for enabling users of enterprise software products to create, publish, and share reviews of enterprise software products. This useful, concrete and tangible result is accomplished through a server-hosted website accessible through the Internet. There are unique challenges with creating and sharing reviews of enterprise software products (compared to other products), and our invention solves these problems using several new and innovative methods we created, which form the basis of this application. Using this website, users of enterprise software can create a review of a product they are using or deploying, and also view reviews created by other users about the enterprise software products they are interested in. With usage, this invention becomes a global repository of enterprise software product reviews and a resource for users worldwide to share opinions and experiences to help each other evaluate, select, buy, and use enterprise software products.
    Type: Application
    Filed: July 10, 2009
    Publication date: January 13, 2011
    Inventors: Jeffrey Gordon Ellingson, Arvind Parthasarathi, Padmanabha Vedam
  • Patent number: 6136460
    Abstract: A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing tin coating. Alternatively, the existing tin coating may be exposed to a chemical bath including the agent and later heated to reflow the tin coating and agent thereby incorporating the agent into the matrix of the tin coating.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: October 24, 2000
    Assignee: Olin Corporation
    Inventors: Szuchain Chen, Julius Fister, Dennis Brauer, Arvind Parthasarathi, Christopher Laurello
  • Patent number: 6083633
    Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: July 4, 2000
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Szuchain F. Chen, Christoper P. Laurello, Arvind Parthasarathi, Derek E. Tyler
  • Patent number: 5969414
    Abstract: There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.
    Type: Grant
    Filed: May 25, 1994
    Date of Patent: October 19, 1999
    Assignee: Advanced Technology Interconnect Incorporated
    Inventors: Arvind Parthasarathi, Deepak Mahulikar
  • Patent number: 5952083
    Abstract: Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: September 14, 1999
    Assignee: Advanced Technology Interconnect, Inc.
    Inventors: Arvind Parthasarathi, Satish Jalota, Jeffrey Schlater, Lynn Strauman, Jeffrey S. Braden
  • Patent number: 5817544
    Abstract: A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires. The package adhesion enhancing layer is from the group consisting essentially of aluminum oxide, anti-tarnish finishes, and dielectrics.The exposed layer on the leadframe is selected from the group consisting essentially of silver, nickel, palladium.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: October 6, 1998
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 5688606
    Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.
    Type: Grant
    Filed: April 18, 1996
    Date of Patent: November 18, 1997
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes, Jeffrey M. Schlater, German J. Ramirez, Dexin Liang
  • Patent number: 5650663
    Abstract: An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.
    Type: Grant
    Filed: July 3, 1995
    Date of Patent: July 22, 1997
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Patent number: 5578869
    Abstract: There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
    Type: Grant
    Filed: March 29, 1994
    Date of Patent: November 26, 1996
    Assignee: Olin Corporation
    Inventors: Paul R. Hoffman, Deepak Mahulikar, George A. Brathwaite, Dawit Solomon, Arvind Parthasarathi