Patents by Inventor Arvind Tirumalai

Arvind Tirumalai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuits And Methods For Sub-Bank Sharing Of External Interfaces
    Publication number: 20220115047
    Abstract: An integrated circuit includes a first input/output lane comprising first external terminals and first driver circuits. The first driver circuits exchange signals with a first external device through the first external terminals as part of a first external interface. The first input/output lane is part of a sub-bank in an input/output bank that implements at least a part of the first external interface. The integrated circuit includes a second input/output lane comprising second external terminals and second driver circuits. The second driver circuits exchange signals with a second external device through the second external terminals as part of a second external interface. The second input/output lane is part of the sub-bank in the input/output bank that implements at least a part of the second external interface.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Archanna Srinivasan, Arvind Tirumalai, Arch Zaliznyak, Gopal Iyer, Hon Khet Chuah, Arun Patel, Kok Kee Looi