Abstract: A linear, low noise, high quality factor (Q) and widely tunable notch filter circuit includes one or more first reactive elements coupled between a first filter node and a first node. The notch filter circuit further includes a multi-branch circuit having multiple parallel branches and coupled between the first node and a second node. Each branch of the multi-branch circuit includes at least a switch coupled to a variable capacitor. A notch frequency of the notch filter circuit is tunable by adjusting a capacitance of the variable capacitor.

Abstract: A linear, low noise, high quality factor (Q) and widely tunable notch filter circuit includes one or more first reactive elements coupled between a first filter node and a first node. The notch filter circuit further includes a multi-branch circuit having multiple parallel branches and coupled between the first node and a second node. Each branch of the multi-branch circuit includes at least a switch coupled to a variable capacitor. A notch frequency of the notch filter circuit is tunable by adjusting a capacitance of the variable capacitor.

Abstract: A wireless communication device includes a first circuit including a baseband circuit and a radio circuit, and at least one frontend module (FEM) remote from the first circuit and placed in close proximity to and coupled to at least one radio-frequency (RF) antenna. The FEM is coupled to the first circuit via interface circuitry. An FEM comprises a frontend (FE) circuit including one or more low-noise amplifiers (LNAs), one or more power amplifiers (PAs), and at least one of a multi-pole switch and a multiplexer. The multi-pole switch and the multiplexer being implemented on a first side of the FEM coupled to the interface circuitry. The interface circuitry includes at least some of filters, splitters, multi-pole switches, and multiplexers to reduce a count of interconnect routes to the at least one FEM.

Abstract: Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.

Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract: A wireless communication device includes a first circuit including a baseband circuit and a radio circuit, and at least one frontend module (FEM) remote from the first circuit and placed in close proximity to and coupled to at least one radio-frequency (RF) antenna. The FEM is coupled to the first circuit via interface circuitry. An FEM comprises a frontend (FE) circuit including one or more low-noise amplifiers (LNAs), one or more power amplifiers (PAs), and at least one of a multi-pole switch and a multiplexer. The multi-pole switch and the multiplexer being implemented on a first side of the FEM coupled to the interface circuitry. The interface circuitry includes at least some of filters, splitters, multi-pole switches, and multiplexers to reduce a count of interconnect routes to the at least one FEM.

Abstract: Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment.

Abstract: Embodiments of the present invention are directed to a wireless resource borrowing environment enabled by a wireless bus comprising a plurality of wireless-enabled components (WECs). In an embodiment, the WECs use the wireless bus to share resource information (including resource availability information) among each others. For example, a WEC may share with other WECs information regarding its processing and memory resources. The WEC may then use the shared resource information to identify resources at other WECs that it may borrow to perform certain tasks. In an embodiment, resource borrowing is performed according to a cost-based method which optimizes resource borrowing according to a cost function. The cost function may be designed to optimize resource borrowing according to any combination of one or more factors, including power consumption, processing speed, delay, interference, error rate, reliability, load at the lender WEC, computing capability at the lender WEC, etc.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Wireless mobile communication (WMC) devices located in operating proximity of each other may be enabled to form a mesh (ad hoc wireless) network. WMC devices in a mesh network may form a queuing system wherein each WMC device may store data forwarded to and/or from other WMC devices in the mesh network. Each WMC device in the mesh network may have different queuing capability based on a plurality of factors that may comprise internal factors such as processing, storage, power, and/or connectivity. The mesh network may comprise an internal addressing scheme that may enable utilization of the queuing system whether or not WMC devices in the mesh network are communicatively coupled to external networks.

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract: A multiservice communication device includes a plurality of transceivers that wirelessly transceive data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols. A control channel transceiver transceives control channel data with a remote management unit including local control data sent to the management unit and remote control data received from the management unit. A processing module processes the remote control data and generates a least one control signal in response thereto, the at least one control signal for adapting at least one of the plurality of transceivers based on the remote control data.

Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

Abstract: A multiservice communication device includes a plurality of transceivers that wirelessly transceive data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols. A control channel transceiver transceives control channel data with a remote management unit including local control data sent to the management unit and remote control data received from the management unit. A processing module processes the remote control data and generates a least one control signal in response thereto, the at least one control signal for adapting at least one of the plurality of transceivers based on the remote control data.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.

Abstract: A multiservice communication device includes a plurality of transceivers that wirelessly transceive data with a corresponding plurality of networks in accordance with a corresponding plurality of network protocols. A control channel transceiver transceives control channel data with a remote management unit including local control data sent to the management unit and remote control data received from the management unit. A processing module processes the remote control data and generates a least one control signal in response thereto, the at least one control signal for adapting at least one of the plurality of transceivers based on the remote control data.

Abstract: A wireless device includes processing circuitry and a Radio Frequency (RF) receiver section. The processing circuitry determines a set of a plurality of information signals of interest within a RF Multiple Frequency Bands Multiple Standards (MFBMS) signal. The RF receiver section down-converts the plurality of information signals by a shift frequency to produce a plurality of down-converted signals and filters the plurality of down-converted signals to produce a plurality of filtered signals corresponding to the set of the information signals of interest. The processing circuitry further extracts data corresponding to the set of the information signals from the plurality of filtered signals.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: A Wireless mobile communication (WMC) device may maintain user preference information, which is unique to the WMC device capabilities and the device user. WMC devices located in near proximity of each other may be enabled to form an ad hoc wireless network wherein each WMC device within the network may function as a router for other devices. Utilizing such routing capability within an ad hoc wireless network may allow WMC devices that are out of their wireless coverage area to use other WMC devices within such ad hoc wireless network to route any impending communication through such other WMC devices wherein these devices may have wireless connectivity to their coverage networks. WMC devices that are may have external connectivity may be enable to be selective in routing information and/or data from other WMC devices in the ad hoc network.