Abstract: Disclosed herein are systems, apparatuses, and methods for wirelessly coupling functional resources. Such a system includes a plurality of co-located, wireless-enabled functional units of a first type and a plurality of co-located, wireless-enabled functional units of a second type. At least one of the wireless-enabled functional units of the first type is wirelessly coupled with one or more of the wireless-enabled functional units of the second type. The wireless-enabled functional units of the first type may be wireless-enabled processing units, and the wireless-enabled functional units of the second type may be wireless-enabled memory units. In an example, the plurality of wireless-enabled functional units of the first type are co-located on a first chip, and the plurality of wireless-enabled functional units of the second type are co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

Abstract: Embodiments of the present invention are directed to a wireless resource borrowing environment enabled by a wireless bus comprising a plurality of wireless-enabled components (WECs). In an embodiment, the WECs use the wireless bus to share resource information (including resource availability information) among each others. For example, a WEC may share with other WECs information regarding its processing and memory resources. The WEC may then use the shared resource information to identify resources at other WECs that it may borrow to perform certain tasks. In an embodiment, resource borrowing is performed according to a cost-based method which optimizes resource borrowing according to a cost function. The cost function may be designed to optimize resource borrowing according to any combination of one or more factors, including power consumption, processing speed, delay, interference, error rate, reliability, load at the lender WEC, computing capability at the lender WEC, etc.

Abstract: Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.

Abstract: Disclosed herein is a configurable system of wireless-enabled components (WECs) and applications thereof. The system includes a plurality of WECs and a controller. Each WEC comprises a functional resource and is adapted to wirelessly communicate with other WECs. The controller is adapted to dynamically configure the functional resource of each WEC and wireless communications among the plurality of WECs to form a field-programmable communications array. The controller may be one of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract: Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices.

Abstract: Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment.

Abstract: Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract: An integrated circuit radio transceiver and method therefor includes a linear regulator an output transistor for producing a current into an output node of the regulator wherein an amplification block is operable to produce a bias signal to a gate terminal of the output transistor to operably bias the output transistor to produce the current into the output node of the regulator. A current steering amplification block is operably disposed to steer current in/out of the gate of the output transistor (depending on device type) based upon the current being conducted through the output node of the regulator exceeding a specified threshold. The current steering amplification block further includes a current sinking element operably disposed to sink a specified amount of current to define the specified threshold.

Abstract: A communications transceiver includes a baseband processor, a receiver section, and a transmitter section that includes a power amplifier. The receiver and transmitter sections communicatively couple to the baseband processor. In a calibration operation, the baseband processor produces a test signal to the transmitter section. Further, the baseband processor causes each of a plurality of power amplifier bias settings to be applied to the power amplifier. For each of the plurality of power amplifier bias settings, the power amplifier produces an amplified test signal, the receiver section couples back a portion of the amplified test signal to the baseband processor, and the baseband processor produces a characterization of the amplified test signal respective. Based upon a plurality of characterizations of the amplified test signal and respective power amplifier bias settings, the baseband processor determines power amplifier bias control settings.

Abstract: A Radio Frequency (RF) transceiver includes a first RF transceiver group, a second RF transceiver group, local oscillation circuitry, and calibration control circuitry. Each of the RF transceiver group has an RF transmitter and an RF receiver. The local oscillation circuitry selectively produces a local oscillation to the first RF transceiver group and to the second RF transceiver group. The calibration control circuitry is operable to initiate calibration operations including transmitter self calibration operations, first loopback calibration operations, and second loopback calibration operations. During loopback calibration operations, test signals produced by an RF transceiver group are looped back to an RF receiver of another RF transceiver group.

Abstract: A radio frequency integrated circuit (RFIC) includes a silicon substrate, CMOS processing circuitry, and a bipolar power amplifier module. The CMOS processing circuitry is on the silicon substrate. The bipolar power amplifier module is on the silicon substrate and is operable in a 5 GHz frequency band.

Abstract: An antenna system includes a wired communications interface, an antenna, and antenna system control circuitry. The wired communications interface is operable to couple to a serviced host device and includes a control interface and an antenna interface. The antenna couples to the antenna interface and has configurable antenna characteristics. The antenna system control circuitry couples to the control interface and to the antenna and is operable to communicate the configurable antenna characteristics to the host device and to configure the antenna based upon communication with the host device. In other constructs the antenna may not be configurable and the antenna characteristics communicated are fixed. The antenna system may further include Radio Frequency (RF) transmit circuitry and/or RF transmit circuitry. Such RF transmit circuitry and RF receive circuitry may be configurable or fixed in its operations.

Abstract: An integrated circuit (IC) includes a clock circuit, a processing module, and processing circuitry. The clock circuit is coupled to produce a digital clock signal. The processing module is coupled to determine whether a harmonic component of the digital clock signal having a nominal digital clock rate is within the frequency passband and to provide an indication to the clock circuit to adjust its rate from the nominal digital clock rate to an adjusted digital clock rate when the harmonic component of the digital clock signal is within the frequency passband. The processing circuitry is coupled to process, at the adjusted digital clock rate, the data to produce processed data having a rate corresponding to the nominal digital clock rate and to interpolate, at an interpolation rate, the processed data to produce interpolated processed data having a rate corresponding to the interpolation rate.

Abstract: A configurable radio frequency (RF) transceiver integrated circuit (IC) includes an RF input/output (IO) module, a plurality of switching modules, and a plurality of components. The RF IO module and selected components of the plurality of components are inter-connected via the at least some of the plurality of switching modules based on a configuration instruction to produce at least one of: at least a portion of a receiver and at least a portion of transmitter.

Abstract: A Radio Frequency (RF) transceiver includes a first RF transceiver group, a second RF transceiver group, local oscillation circuitry, and calibration control circuitry. Each of the RF transceiver group has an RF transmitter and an RF receiver. The local oscillation circuitry selectively produces a local oscillation to the first RF transceiver group and to the second RF transceiver group. The calibration control circuitry is operable to initiate calibration operations including transmitter self calibration operations, first loopback calibration operations, and second loopback calibration operations. During loopback calibration operations, test signals produced by an RF transceiver group are looped back to an RF receiver of another RF transceiver group.

Abstract: On-chip MOS circuitry couples a communication path between an output stage amplifier and an output port and disables a circuit path between an input amplifier and the output port by creating a high impedance circuit during transmit operations. Alternatively, the circuitry opens the transmit circuit path with an isolated MOSFET and enables the second circuit path by creating an impedance matched circuit. The switch is formed within an isolated region to allow it to float with a signal to avoid breakdown. This floating MOS switch can be used for a variety of other applications in addition to its use as a transmit/receive switch even though formed on the same die as the communication circuitry.

Abstract: A multiple band direct conversion radio frequency (RF) transceiver integrated circuit (IC) includes a multiple band direct conversion transmitter section, a multiple band direct conversion receiver section, and a local oscillation module. The multiple band direct conversion transmitter section includes a transmit baseband module and a multiple frequency band transmission module. The multiple band direct conversion receiver section includes a multiple frequency band reception module and a receiver baseband module. The local oscillation generation module is coupled to generate a first frequency band local oscillation when the multiple band direct conversion RF transceiver IC is in the first mode and coupled to generate a second frequency band local oscillation when the multiple band direct conversion RF transceiver IC is in the second mode.