Patents by Inventor Asad Azam

Asad Azam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12073225
    Abstract: A data processing system comprises a processing core to execute a basic input/output system (BIOS) as part of a boot process. The data processing system also comprises static random-access memory (SRAM) in communication with the processing core. The data processing system also comprises a pre-BIOS component in communication with the SRAM. The pre-BIOS component is configured to execute a pre-BIOS block before the processing core begins executing the BIOS. The pre-BIOS block, when executed by the pre-BIOS component, causes the pre-BIOS component to (a) initialize the pre-BIOS component, (b) measure an amount of time taken to initialize the pre-BIOS component, and (c) save the measured amount of time to the SRAM as a pre-BIOS boot-time record. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: August 27, 2024
    Assignee: Intel Corporation
    Inventors: Subrata Banik, Asad Azam, Vincent James Zimmer, Rajaram Regupathy
  • Publication number: 20240201730
    Abstract: Embodiments of the present disclosure include techniques for synchronizing processors. In one embodiment, one or more processors on different integrated circuit die are synchronized using a synchronization circuit on one of the die. The synchronization circuit receives count phases and adjusts clock signals, and counts in some embodiments, to synchronize the processors. In one embodiment, the synchronization circuit comprises a phase detector that receives particular bits of the count signal as the count phases.
    Type: Application
    Filed: December 19, 2022
    Publication date: June 20, 2024
    Inventors: Charles Walter BOECKER, Piyush Abhay HATOLKAR, Asad AZAM, Maya SUBHADRA
  • Patent number: 11941409
    Abstract: Systems, methods, and apparatuses relating to circuitry to implement a multiprocessor boot flow for a faster boot process are described. In one embodiment, a system includes a hardware processor comprising a processor core, a cache coupled to the hardware processor, storage for hardware initialization code, and a controller circuit to initialize a portion of the cache as memory for usage by the hardware initialization code before beginning execution of the hardware initialization code after a power on of the system.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Subrata Banik, Asad Azam, Jenny M. Pelner, Vincent Zimmer, Rajaram Regupathy
  • Patent number: 11841776
    Abstract: Methods, systems and apparatuses may provide for technology that includes a chip having a first die including a first processing logic to execute a first application instance and generate a first output of the first application instance, and a second processing logic to execute a second application instance and generate a second output of the second application instance. The chip may also include a second die coupled to the first die, wherein the second die includes a safety monitor detect a condition associated with one or more of an error in the first output, an error in the second output, or a discrepancy between the first output and the second output. The safety monitor may also initiate a transition of the chip into a safe state in response to the condition.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: December 12, 2023
    Assignee: Intel Corporation
    Inventors: Nabajit Deka, Riccardo Mariani, Asad Azam, Roger May, Prashanth Gadila
  • Publication number: 20230385070
    Abstract: Embodiments are directed to improving boot process for early display initialization and visualization. An embodiment of a system includes a plurality of processor cores; a cache coupled to the plurality of processor cores; and a controller circuit to: initialize a portion of the cache as static memory for hardware initialization code usage before beginning execution of the hardware initialization code after a power on of the hardware processor; and cause initialization of a display device to be performed using the portion of the cache, the initialization of the display device performed independently of initialization of dynamic memory of the hardware processor.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 30, 2023
    Applicant: Intel Corporation
    Inventors: Subrata Banik, Maulik V. Vaghela, Rajaram Regupathy, Vincent Zimmer, Asad Azam
  • Patent number: 11768691
    Abstract: Embodiments are directed to improving boot process for early display initialization and visualization. An embodiment of a system includes a plurality of processor cores; a cache coupled to the plurality of processor cores; and a controller circuit to: initialize a portion of the cache as static memory for hardware initialization code usage before beginning execution of the hardware initialization code after a power on of the hardware processor; and cause initialization of a display device to be performed using the portion of the cache, the initialization of the display device performed independently of initialization of dynamic memory of the hardware processor.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: September 26, 2023
    Assignee: INTEL CORPORATION
    Inventors: Subrata Banik, Maulik V. Vaghela, Rajaram Regupathy, Vincent Zimmer, Asad Azam
  • Patent number: 11506702
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: November 22, 2022
    Assignee: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Patent number: 11335428
    Abstract: The disclosed embodiments relate to method, apparatus and system for testing memory circuitry and diagnostic components designed to test the memory circuitry. The memory may be tested regularly using Memory Built-In Self-Test (MBIST) to detect memory failure. Error Correction Code (ECC)/Parity is implemented for SRAM/Register Files/ROM memory structures to protect against transient and permanent faults during runtime. ECC/Parity encoder and decoder logic detect failure on both data and address buses and are intended to catch soft error or structural fault in address decoding logic in SRAM Controller, where data may be read/written from/to different locations due to faults. ECC/parity logic on the memory structures are subject to failures. In certain exemplary embodiments, an array test controller is used to generate and transmit error vectors to thereby determine faulty diagnostic components. The test vectors may be generated randomly to test the diagnostic components during run-time for in-field testing.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 17, 2022
    Assignee: INTEL CORPORATION
    Inventors: Asad Azam, R Selvakumar Raja Gopal, Sreejit Chakravarty, Kaitlyn Chen
  • Publication number: 20220091853
    Abstract: A data processing system comprises a processing core to execute a basic input/output system (BIOS) as part of a boot process. The data processing system also comprises static random-access memory (SRAM) in communication with the processing core. The data processing system also comprises a pre-BIOS component in communication with the SRAM. The pre-BIOS component is configured to execute a pre-BIOS block of firmware before the processing core begins executing the BIOS. The pre-BIOS block, when executed by the pre-BIOS component, causes the pre-BIOS component to (a) initialize the pre-BIOS component, (b) measure an amount of time taken to initialize the pre-BIOS component, and (c) save the measured amount of time to the SRAM as a pre-BIOS boot-time record. Other embodiments are described and claimed.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 24, 2022
    Inventors: SUBRATA BANIK, ASAD AZAM, VINCENT JAMES ZIMMER, RAJARAM REGUPATHY
  • Patent number: 11250167
    Abstract: Various systems and methods for implementing secure system-on-chip (SoC) debugging are described herein. A method of providing secure system-on-a-chip (SoC) debugging, comprises: receiving, from a remote host at a debug companion circuit, a debug initiation request to initiate a debugging session with an SoC associated with the debug companion circuit; encrypting, at the debug companion circuit, a debug handshake command; transmitting the debug handshake command to the SoC from the debug companion circuit, wherein the SoC is configured to authenticate the debug companion circuit, and configure intellectual property (IP) blocks on the SoC to expose debug data to the debug companion circuit in response to authenticating the debug companion circuit; and managing a secure connection with the SoC to obtain debug data and report the debug data to the remote host.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: R Selvakumar Raja Gopal, Asad Azam
  • Patent number: 11243585
    Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: February 8, 2022
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Rao Jagannadha Rapeta, Asad Azam
  • Publication number: 20210326142
    Abstract: Systems, methods, and apparatuses relating to circuitry to implement a multiprocessor boot flow for a faster boot process are described. In one embodiment, a system includes a hardware processor comprising a processor core, a cache coupled to the hardware processor, storage for hardware initialization code, and a controller circuit to initialize a portion of the cache as memory for usage by the hardware initialization code before beginning execution of the hardware initialization code after a power on of the system.
    Type: Application
    Filed: June 27, 2020
    Publication date: October 21, 2021
    Inventors: SUBRATA BANIK, ASAD AZAM, JENNY M. PELNER, VINCENT ZIMMER, RAJARAM REGUPATHY
  • Patent number: 11120642
    Abstract: Methods and apparatus relating to functional safety critical audio system for autonomous and industrial applications are described. In an embodiment, safety island logic circuitry transmits an enable signal to cause initiation of a functional safety test for an audio component in a vehicle. Audio processing logic circuitry receives the enable signal and causes activation of power amplifier logic circuitry, in response to the enable signal, to drive the audio component in accordance with an audio alert test signal. The audio component includes a Parametric Acoustic Array (PAA) transducer. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 14, 2021
    Assignee: INTEL CORPORATION
    Inventors: Jagannadha Rao Rapeta, Asad Azam, Amit Kumar Srivastava
  • Patent number: 11113402
    Abstract: Methods, systems and apparatuses may provide for technology that includes a system on chip (SoC) having a root of trust and an embedded controller to conduct functional safety operations and non-functional safety operations with respect to the SoC. The technology may also include an enhanced serial peripheral interface (eSPI) coupled to the SoC and the embedded controller, wherein the eSPI is to tunnel communications associated with the functional safety operations between the embedded controller and the root of trust.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Mikal Hunsaker, Mark Feuerstraeter, Asad Azam, Zhenyu Zhu, Navtej Singh
  • Patent number: 11073554
    Abstract: Apparatuses of a scan controller include memory and circuitry, where the circuitry is configured to respond to a first signal by sending a second signal to isolate state retention elements from non-state retention elements in a scan chain of power gating circuitry and cycling through the scan chain while obtaining state retention data from the state retention elements during each cycle. The circuitry may be further configured to determine a first error detection code from the state retention data and store the error detection code in the memory. The circuitry may be configured to determine a second error detection code in response to another signal and compare the first error detection code with the second error detection code. The circuitry may be configured to send a signal indicating that the state retention data is corrupted if the first error detection code does not match the second error detection code.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 27, 2021
    Assignee: Intel Corporation
    Inventors: Asad Azam, Dhinesh A/L Sasidaran, R Selvakumar Raja Gopal
  • Patent number: 11036266
    Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: June 15, 2021
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Rao Jagannadha Rapeta, Asad Azam
  • Patent number: 10955805
    Abstract: An apparatus of a System on Chip (SoC) to implement a one out of two diagnostics (1oo2D) safety system comprises a memory comprising firmware to provide monitoring of the SoC and a second SoC, and a communication interface to provide cross-monitoring between the SoC and the second SoC. The firmware and the communication interface enable the SoC and the second SoC to implement the 1oo2D safety system without significant hardware or software external to the SoC.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: March 23, 2021
    Assignee: Intel Corporation
    Inventors: Nabajit Deka, Riccardo Mariani, Asad Azam, Rajesh Banginwar, Wenjun Zhang
  • Patent number: 10942880
    Abstract: An integrated circuit for monitoring components of the integrated circuit, comprising: a resource monitoring circuit configured to: track activity factors for a plurality of components of the integrated circuit; evaluate the activity factors for each of the plurality of components; determine whether an activity factor for a particular component of the plurality of components exceeds a threshold; and transmit, from the resource monitoring circuit, a signal to a software element, causing the software element to deactivate the particular component and activate an alternate component, when the activity factor for the particular component exceeds the threshold and the alternate component is available to substitute for the particular component.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: March 9, 2021
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Asad Azam
  • Patent number: 10928449
    Abstract: Technologies for built-in self-testing of a memory array using error detection and correction code knowledge include identifying data errors between pseudo random data written to the memory array and the data read back from the memory array and ignoring those data errors determined to be correctable. The data errors may be determined to be correctable if an error corrector circuit can correct those errors or if the number of errors per memory chuck is less than a number of errors correctable by the error correct circuit.
    Type: Grant
    Filed: March 30, 2019
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventors: Asad Azam, R Selvakumar Raja Gopal, Kaitlyn Chen
  • Publication number: 20210003629
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 7, 2021
    Applicant: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar