Abstract: A device includes multiple memory devices, a bus splitter and a package. The bus splitter is configured to exchange storage commands and data with an external host using an external Input/Output (I/O) bus, and to distribute the storage commands and the data over multiple buses connected to respective subsets of the memory devices, so as to relay the storage commands and the data between the multiple memory devices and the external host. The memory devices and the bus splitter are contained in the package, in a multi-chip package (MCP) structure.

Abstract: Apparatus includes multiple memory devices and a memory controller. The memory controller is configured to store and retrieve data by communicating with the memory devices over a first bus interface, and to query a status of the memory devices by communicating with the memory devices over a second bus interface that is separate from the first bus interface.