Patents by Inventor Asaf J. Shenberg

Asaf J. Shenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155094
    Abstract: Embodiments are generally directed to selective packing of patches for immersive video. An embodiment of a processing system includes one or more processor cores; and a memory to store data for immersive video, the data including a plurality of patches for multiple projection directions. The system is select the patches for packing, the selection of the patches based at least in part on which of the multiple projection directions is associated with each of the patches. The system is to encode the patches into one or more coded pictures according to the selection of the patches.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 9, 2024
    Applicant: Intel Corporation
    Inventors: Eyal Ruhm, Jill Boyce, Asaf J. Shenberg
  • Patent number: 11863731
    Abstract: Embodiments are generally directed to selective packing of patches for immersive video. An embodiment of a processing system includes one or more processor cores; and a memory to store data for immersive video, the data including a plurality of patches for multiple projection directions. The system is select the patches for packing, the selection of the patches based at least in part on which of the multiple projection directions is associated with each of the patches. The system is to encode the patches into one or more coded pictures according to the selection of the patches.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: January 2, 2024
    Assignee: INTEL CORPORATION
    Inventors: Eyal Ruhm, Jill Boyce, Asaf J. Shenberg
  • Publication number: 20210266515
    Abstract: Embodiments are generally directed to selective packing of patches for immersive video. An embodiment of a processing system includes one or more processor cores; and a memory to store data for immersive video, the data including a plurality of patches for multiple projection directions. The system is select the patches for packing, the selection of the patches based at least in part on which of the multiple projection directions is associated with each of the patches. The system is to encode the patches into one or more coded pictures according to the selection of the patches.
    Type: Application
    Filed: December 31, 2020
    Publication date: August 26, 2021
    Applicant: Intel Corporation
    Inventors: Eyal Ruhm, Jill Boyce, Asaf J. Shenberg
  • Patent number: 10887574
    Abstract: Embodiments are generally directed to selective packing of patches for immersive video. An embodiment of a processing system includes one or more processor cores; and a memory to store data for immersive video, the data including a plurality of patches for multiple projection directions. The system is select the patches for packing, the selection of the patches based at least in part on which of the multiple projection directions is associated with each of the patches. The system is to encode the patches into one or more coded pictures according to the selection of the patches.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: January 5, 2021
    Assignee: INTEL CORPORATION
    Inventors: Eyal Ruhm, Jill Boyce, Asaf J. Shenberg
  • Patent number: 10735826
    Abstract: An embodiment of a semiconductor package apparatus may include technology to store a block of self-contained data including one or more time sequential frames of image data from two or more camera positions, and access a portion of the image data based on a start location and offset information from a header of the block. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 4, 2020
    Assignee: Intel Corporation
    Inventors: Eyal Ruhm, Asaf J. Shenberg
  • Publication number: 20200045290
    Abstract: Embodiments are generally directed to selective packing of patches for immersive video. An embodiment of a processing system includes one or more processor cores; and a memory to store data for immersive video, the data including a plurality of patches for multiple projection directions. The system is select the patches for packing, the selection of the patches based at least in part on which of the multiple projection directions is associated with each of the patches. The system is to encode the patches into one or more coded pictures according to the selection of the patches.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 6, 2020
    Applicant: Intel Corporation
    Inventors: Eyal Ruhm, Jill Boyce, Asaf J. Shenberg
  • Patent number: 10497170
    Abstract: An apparatus and method for occlusion data compression. For example, one embodiment of a graphics processing apparatus comprises: vertex generation circuitry/logic to generate vertices of objects in a 3D space including occlusion binary vectors for the vertices, the objects captured by a set of M cameras; sorting circuitry/logic to sort the vertices in accordance with coordinates of the vertices; pre-compression circuitry/logic to transform the occlusion binary vectors of the vertices by logically combining adjacent bit fields in the sorted order to generate converted bit strings having a larger number of binary zero values than the occlusion binary vectors; compression circuitry/logic to compress the converted bit strings using run length encoding (RLE) compression to generate compressed bit fields; and a memory and/or storage device to store the compressed bit fields.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: December 3, 2019
    Assignee: INTEL CORPORATION
    Inventors: Ilya Romm, Eyal Ruhm, Asaf J Shenberg, Maxym Dmytrychenko
  • Publication number: 20190206016
    Abstract: An apparatus and method for occlusion data compression. For example, one embodiment of a graphics processing apparatus comprises: vertex generation circuitry/logic to generate vertices of objects in a 3D space including occlusion binary vectors for the vertices, the objects captured by a set of M cameras; sorting circuitry/logic to sort the vertices in accordance with coordinates of the vertices; pre-compression circuitry/logic to transform the occlusion binary vectors of the vertices by logically combining adjacent bit fields in the sorted order to generate converted bit strings having a larger number of binary zero values than the occlusion binary vectors; compression circuitry/logic to compress the converted bit strings using run length encoding (RLE) compression to generate compressed bit fields; and a memory and/or storage device to store the compressed bit fields.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: ILYA ROMM, EYAL RUHM, ASAF J SHENBERG, MAXYM DMYTRYCHENKO
  • Publication number: 20190045276
    Abstract: An embodiment of a semiconductor package apparatus may include technology to store a block of self-contained data including one or more time sequential frames of image data from two or more camera positions, and access a portion of the image data based on a start location and offset information from a header of the block. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: December 20, 2017
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Eyal Ruhm, Asaf J. Shenberg