Abstract: The invention seeks to increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5T to 1T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.

Abstract: The present invention provides a frit containing substantially no lead, which is applicable to a member having ? of at most 50×10?7/° C. A frit comprising a low-melting point glass powder and a refractory filler powder, containing substantially no lead, having a thermal expansion coefficient of at most 50×10?7/° C., and being processable at 500° C. or lower, wherein the above low-melting point glass powder satisfies a softening pour point range of at least 30° C., and the above refractory filler powder satisfies the following relationship: 1<S×?<10 S: specific surface area (m2/g) ?: density (g/cm3).

Abstract: To increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5 T to 1 T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.

Abstract: Laser sealing property and reliability of a glass panel are increased by suppressing cracks, fractures, separation and the like of glass substrates and a sealing material layer at the time of laser sealing. A first paste for a sealing material containing no laser absorbent and a second paste for a sealing material containing a laser absorbent are applied in this order on a sealing region 2a of a glass substrate 2. A laminate film of a coating layer 11 of the first paste for a sealing material and a coating layer 12 of the second paste for a sealing material is fired, to form a sealing material layer 3 having a laminated structure of a layer 4 of the first glass material for sealing and a layer 5 of the second glass material for sealing.

Abstract: The present invention provides a frit containing substantially no lead, which is applicable to a member having ? of at most 50×10<7/° C. A frit comprising a low-melting point glass powder and a refractory filler powder, containing substantially no lead, having a thermal expansion coefficient of at most 50×10?7/° C., and being processable at 500° C. or lower, wherein the above low-melting point glass powder satisfies a softening pour point range of at least 30° C.

Abstract: A low melting glass, which contains substantially no lead and contains 70-90% of Bi2O3, 1-20% of ZnO, 2-12% of B2O3, 0.1-5% of Al2O3, 0.1-5% of CeO2, 0-5% of CuO, 0-0.2% of Fe2O3 and 0.05-5% of CuO+Fe2O3 in mass %, wherein a content of alkali metal oxides in the glass composition is less than 0.1%, and the glass does not crystallize by pre-baking at a sealing temperature or more, can be used for sealing later, and can suppress deterioration of a material such as platinum or platinum-rhodium to provide a stable melting operation for a long period.

Abstract: A low melting glass, which contains substantially no lead and contains 70-90% of Bi2O3, 1-20% of ZnO, 2-12% of B2O3, 0.1-5% of Al2O3, 0.1-5% of CeO2, 0-5% of CuO, 0-0.2% of Fe2O3and 0.05-5% of CuO+Fe2O3 in mass %, wherein a content of alkali metal oxides in the glass composition is less than 0.1%, and the glass does not crystallize by pre-baking at a sealing temperature or more, can be used for sealing later, and can suppress deterioration of a material such as platinum or platinum-rhodium to provide a stable melting operation for a long period.