Patents by Inventor Asahi KASUE

Asahi KASUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE RESIN MATERIAL
    Publication number: 20240132767
    Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.
    Type: Application
    Filed: March 9, 2022
    Publication date: April 25, 2024
    Inventors: Keiichi KOMATSU, Asahi KASUE, Atsushi YAMAGUCHI
  • THERMAL INTERFACE COMPOSITION AND THERMAL INTERFACE MATERIAL
    Publication number: 20240026203
    Abstract: The present disclosure provides a thermal interface composition that allows a thermal interface material with high thermal conductivity to be formed and that has good moldability. A thermal interface composition according to the present disclosure includes: a resin (A); and a carbon-based material (B) having a surface coated with an inorganic substance.
    Type: Application
    Filed: October 5, 2023
    Publication date: January 25, 2024
    Inventor: Asahi KASUE