Abstract: In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22. In the cavity 22, a detecting unit 12 of a sensor is in an exposed condition. Next, by sputtering, an Al film 16 is deposited in the etching hole 21 and on an upper face of a substrate. Thereafter, a portion of the Al film 16 positioned on the polysilicon film 14 is removed by etching back, thereby leaving only a metal closure 16a of Al which closes the etching hole. The sputtering step is performed under a pressure of 5 Pa or less, so that the pressure in the cavity can be held to be low.

Abstract: An electronic device according to the present invention includes: at least one heat sensing section (13), which includes a first contact portion (24) and of which a physical property varies responsive to an incoming infrared ray; a detector circuit section, which includes a second contact portion (42) and which senses the variation in the physical property of the heat sensing section (13); and a driving section (112), which is able to change a first state, in which the first and second contact portions (24, 42) are in contact with each other and electrically connected to each other, into a second state, in which the first and second contact portions (24, 42) are out of contact with each other and electrically disconnected from each other, and vice versa.

Abstract: An electronic device according to the present invention includes: at least one heat sensing section (13), which includes a first contact portion (24) and of which a physical property varies responsive to an incoming infrared ray; a detector circuit section, which includes a second contact portion (42) and which senses the variation in the physical property of the heat sensing section (13); and a driving section (112), which is able to change a first state, in which the first and second contact portions (24, 42) are in contact with each other and electrically connected to each other, into a second state, in which the first and second contact portions (24, 42) are out of contact with each other and electrically disconnected from each other, and vice versa.

Abstract: In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22. In the cavity 22, a detecting unit 12 of a sensor is in an exposed condition. Next, by sputtering, an Al film 16 is deposited in the etching hole 21 and on an upper face of a substrate. Thereafter, a portion of the Al film 16 positioned on the polysilicon film 14 is removed by etching back, thereby leaving only a metal closure 16a of Al which closes the etching hole. The sputtering step is performed under a pressure of 5 Pa or less, so that the pressure in the cavity can be held to be low.

Abstract: In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22. In the cavity 22, a detecting unit 12 of a sensor is in an exposed condition. Next, by sputtering, an Al film 16 is deposited in the etching hole 21 and on an upper face of a substrate. Thereafter, a portion of the Al film 16 positioned on the polysilicon film 14 is removed by etching back, thereby leaving only a metal closure 16a of Al which closes the etching hole. The sputtering step is performed under a pressure of 5 Pa or less, so that the pressure in the cavity can be held to be low.

Abstract: An electronic device according to the present invention includes: a cavity, which is surrounded with a cavity wall portion and which has a reduced pressure; a gettering thin film, which is arranged in the cavity and has the function of adsorbing a surrounding substance; and an activating portion, at least a part of which is arranged in the cavity and which has the function of activating the gettering thin film by generating heat.

Abstract: An electronic device according to the present invention includes: a cavity, which is surrounded with a cavity wall portion and which has a reduced pressure; a gettering thin film, which is arranged in the cavity and has the function of adsorbing a surrounding substance; and an activating portion, at least a part of which is arranged in the cavity and which has the function of activating the gettering thin film by generating heat.

Abstract: In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22. In the cavity 22, a detecting unit 12 of a sensor is in an exposed condition. Next, by sputtering, an Al film 16 is deposited in the etching hole 21 and on an upper face of a substrate. Thereafter, a portion of the Al film 16 positioned on the polysilicon film 14 is removed by etching back, thereby leaving only a metal closure 16a of Al which closes the etching hole. The sputtering step is performed under a pressure of 5 Pa or less, so that the pressure in the cavity can be held to be low.

Abstract: An optical delay line of a configuration in which a number of components such as a circulator and an optical coupler is reduced is to be provided. To this end, the optical delay line has a configuration in which, after an optical fiber diffraction grating having a core subjected to refractive index modulation and a cladding partly cleared of its outer circumference and an optical fiber having a cladding partly cleared of its outer circumference are brought close to each other so that the cores have mutually parallel directions of an optical axis to fabricate a directional coupler, both ends of the optical fiber are connected into an optical fiber loop. In this way, an optical delay line to generate a specific time delay for controlling optical signals can be provided in small dimensions and with a small number of components.

Abstract: There is provided a dispersion compensator that solves a problem of loss due to radiation mode and has a wide band and causes smaller insertion loss, and is compact in size and inexpensive. To achieve this, the dispersion compensator is constructed to comprise a fiber Bragg grating subjected to refractive index modulation to reflect lights of various wavelengths, wherein a core part of the fiber Bragg grating includes plural refractive index modulation parts that become continuously shorter in reflection wavelength toward a longitudinal direction from a light incidence side and are in positions different from each other in the longitudinal direction, and a discontinuous part, provided between the refractive index modulation parts, in which reflection wavelength shifts discontinuously to the long wavelength side. Light is inputted and outputted to and from the fiber Bragg grating by use of an optical circulator or the like.

Abstract: An optical delay line of a configuration in which a number of components such as a circulator and an optical coupler is reduced is to be provided. To this end, the optical delay line has a configuration in which, after an optical fiber diffraction grating having a core subjected to refractive index modulation and a cladding partly cleared of its outer circumference and an optical fiber having a cladding partly cleared of its outer circumference are brought close to each other so that the cores have mutually parallel directions of an optical axis to fabricate a directional coupler, both ends of the optical fiber are connected into an optical fiber loop. In this way, an optical delay line to generate a specific time delay for controlling optical signals can be provided in small dimensions and with a small number of components.

Abstract: It includes: a substrate; a plurality of optical data processing units arranged in an array on the substrate, a super graphite sheet on LEDs of the optical processing units, and a glass substrate on the super graphite sheet. Each optical data processing unit includes an optical signal receiving circuit on the substrate for receiving an optical signal and generating a reception signal; a data processing circuit on the substrate for processing the reception signal and generating resultant data; a drive circuit and an LED on the substrate for emitting an output optical signal and heat in accordance with the resultant data. The super graphite sheet on the LED transmits and radiates the heat from the LEDs. The super graphite film is provided by sintering a high polymer sheet and has a high heat conductivity.