Patents by Inventor Asako Ogasawara
Asako Ogasawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11578028Abstract: The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). In the formula, R1 represents one or two groups selected from groups below, D1 represents a polymerizable unsaturated group represented by chemical formula D1-1 or D1-2 below, R2 represents a hydrogen atom or a methyl group, m1 and m2 represent 1 to 2, A1 represents an alkylene group with 2 to 4 carbon atoms, and m3 represents 1 to 100.Type: GrantFiled: August 22, 2017Date of Patent: February 14, 2023Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Masatake Joyabu, Kei Shiohara, Asako Ogasawara, Takuro Kimura, Chi Tao
-
Publication number: 20220372220Abstract: Provided is a surfactant composition that can impart good polymerization stability, that can yield an aqueous resin dispersion having good wettability, and that can improve water resistance and water-resistant adhesive strength of a resin film formed from the aqueous resin dispersion. The surfactant composition according to the present invention includes a compound C1 represented by formula (1): (in formula (1), A1 represents an alkylene group having 10 to 14 carbon atoms, A2 represents an alkylene group having 2 to 4 carbon atoms, n is an average number of moles of an oxyalkylene group A2O added and is a number of 1 to 100, and X represents a hydrogen atom, a sulfate ester or a salt thereof, a phosphate ester or a salt thereof, or methylcarboxylic acid or a salt thereof); and a compound C2 represented by formula (2): (in formula (2), A1, A2, n, and X are as defined in formula (1)). A molar ratio C1/C2 of the compound C1 to the compound C2 is 99/1 to 84/16.Type: ApplicationFiled: September 23, 2020Publication date: November 24, 2022Applicant: DKS Co. Ltd.Inventors: Masatake JOYABU, Kei SHIOHARA, Asako OGASAWARA, Takuro KIMURA, Chi TAO
-
Patent number: 10940453Abstract: The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). R1 represents an alkyl group with 8 to 14 carbon atoms, A represents an alkylene group with 2 to 4 carbon atoms, and n representing an average number of moles of an oxyalkylene group added represents 1 to 100.Type: GrantFiled: August 22, 2017Date of Patent: March 9, 2021Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Masatake Joyabu, Kei Shiohara, Asako Ogasawara, Takuro Kimura, Chi Tao
-
Publication number: 20200331830Abstract: The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). In the formula, R1 represents one or two groups selected from groups below, D1 represents a polymerizable unsaturated group represented by chemical formula D1-1 or D1-2 below, R2 represents a hydrogen atom or a methyl group, m1 and m2 represent 1 to 2, A1 represents an alkylene group with 2 to 4 carbon atoms, and m3 represents 1 to 100.Type: ApplicationFiled: August 22, 2017Publication date: October 22, 2020Inventors: Masatake JOYABU, Kei SHIOHARA, Asako OGASAWARA, Takuro KIMURA, Chi TAO
-
Publication number: 20200199277Abstract: Provided is a copolymer that can be used as a dispersant having high dispersibility and high slump retention capability. A copolymer according to an embodiment is a water-soluble copolymer that contains, as constituent monomers, at least one monomer selected from a monomer (A) represented by formula (1) and a monomer (B) represented by formula (2), and at least one monomer (C) selected from an unsaturated carboxylic acid monomer (C-1) and an oxyethylene group-containing unsaturated carboxylic acid ester (C-2). The content of the monomer (C) is 20 mass % or more and 99 mass % or less.Type: ApplicationFiled: September 15, 2018Publication date: June 25, 2020Applicant: DAI-ICHI KOGYO SEIYAKU CO., LTDInventors: Masatake JOYABU, Kei SHIOHARA, Asako OGASAWARA, Takuro KIMURA, Chi TAO, Yuki TAKAMACHI
-
Patent number: 10457754Abstract: The present invention relates to an aqueous resin dispersion, obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.Type: GrantFiled: October 28, 2015Date of Patent: October 29, 2019Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Asako Ogasawara, Toshio Kagimasa, Masatake Joyabu
-
Publication number: 20190217265Abstract: The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). R1 represents an alkyl group with 8 to 14 carbon atoms, A represents an alkylene group with 2 to 4 carbon atoms, and n representing an average number of moles of an oxyalkylene group added represents 1 to 100.Type: ApplicationFiled: August 22, 2017Publication date: July 18, 2019Applicant: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Masatake JOYABU, Kei SHIOHARA, Asako OGASAWARA, Takuro KIMURA, Chi TAO
-
Patent number: 10280341Abstract: The present invention relates to an adhesive agent composition, containing an aqueous resin dispersion obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.Type: GrantFiled: October 28, 2015Date of Patent: May 7, 2019Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Asako Ogasawara, Shigeru Kigasawa, Masatake Joyabu
-
Publication number: 20170327602Abstract: The present invention relates to an aqueous resin dispersion, obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.Type: ApplicationFiled: October 28, 2015Publication date: November 16, 2017Applicant: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Asako OGASAWARA, Toshio KAGIMASA, Masatake JOYABU
-
Publication number: 20170306192Abstract: The present invention relates to an adhesive agent composition, containing an aqueous resin dispersion obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.Type: ApplicationFiled: October 28, 2015Publication date: October 26, 2017Applicant: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Asako OGASAWARA, Shigeru KIGASAWA, Masatake JOYABU
-
Patent number: 9637563Abstract: A reactive surfactant composition comprising one or more kinds of reactive surfactants is disclosed that may be used as an emulsifier for emulsion polymerization, a dispersant for suspension polymerization, a nonaqueous dispersant, or a resin modifier.Type: GrantFiled: June 19, 2014Date of Patent: May 2, 2017Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventor: Asako Ogasawara
-
Patent number: 9376510Abstract: A reactive emulsifier comprising a compound of formula (I), which makes polymerization stability satisfactory and is capable of improving the water resistance etc. of the polymer film to be obtained. In the formula (I), D represents a polymerizable unsaturated group represented by the chemical formula D-1 or D-2; m1 represents a number of 1 or larger; R1 represents an alkyl group having 1 to 12 carbon atoms; m2 represents a number of 0 to 4; and the sum of m1 and m2 is 1 to 5. R2 represents a hydrocarbon group having 6 to 30 carbon atoms; A represents either an alkylene group or a substituted alkylene group which has 2 to 4 carbon atoms; and n is in the range of 0 to 1,000. X represents a hydrogen atom or an anionic hydrophilic group which is —(CH2)a—SO3M etc. R3 represents a hydrogen atom or methyl.Type: GrantFiled: September 18, 2012Date of Patent: June 28, 2016Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Asako Ogasawara, Masayuki Hashimoto
-
Patent number: 9353195Abstract: An emulsifier for emulsion polymerization includes a compound represented by the following general: X=H, —(CH2)a—SO3M, —(CH2)b—COOM, —PO3M2, —P(B)O2M, or —CO—CH2—CH(SO3M)-COOM Y= Z=Type: GrantFiled: December 12, 2012Date of Patent: May 31, 2016Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Asako Ogasawara, Masayuki Hashimoto
-
Publication number: 20160137755Abstract: A reactive surfactant composition comprising one or more kinds of reactive surfactants is disclosed that may be used as an emulsifier for emulsion polymerization, a dispersant for suspension polymerization, a nonaqueous dispersant, or a resin modifier.Type: ApplicationFiled: June 19, 2014Publication date: May 19, 2016Applicant: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventor: Asako OGASAWARA
-
Patent number: 9199902Abstract: An emulsifier for emulsion polymerization contains a compound represented by the following general formula (I).Type: GrantFiled: July 9, 2014Date of Patent: December 1, 2015Assignee: Dai-Ichi Kogyo Seiyaku co., Ltd.Inventors: Asako Ogasawara, Masayuki Hashimoto
-
Patent number: 9102603Abstract: An emulsifier for emulsion polymerization contains a compound represented by the following general formula (I).Type: GrantFiled: January 9, 2013Date of Patent: August 11, 2015Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Asako Ogasawara, Masayuki Hashimoto
-
Patent number: 9006334Abstract: As a manufacturing method of a stable coumarone-indene resin water-dispersed composition which does not use an organic solvent, can be applied to various resin compositions, enhance sticky and adhesive properties, water resistance, heat resistance, and compatibility, and achieve consideration of health and safety of operators, arrangement of a work environment, and cost reduction relating to exhaust gas treatment, a manufacturing method which includes a process of dispersing a coumarone-indene resin which contains 50% by weight or more of coumarone and indene in total as monomer-constituents and is in a solid form at an ordinary temperature in the presence of a surfactant by a wet milling and dispersing method is used.Type: GrantFiled: November 7, 2011Date of Patent: April 14, 2015Assignees: Dai-Ichi Kogyo Seiyaku Co., Ltd., Nitto Chemical Co., Ltd.Inventors: Masayuki Hashimoto, Asako Ogasawara, Tadashi Kimura, Kimiko Izumi
-
Publication number: 20150038654Abstract: An emulsifier for emulsion polymerization includes a compound represented by the following general: X=H, —(CH2)a—SO3M, —(CH2)b—COOM, —PO3M2, —P(B)O2M, or —CO—CH2—CH(SO3M)-COOM Y= Z=Type: ApplicationFiled: December 12, 2012Publication date: February 5, 2015Inventors: Asako Ogasawara, Masayuki Hashimoto
-
Publication number: 20150011790Abstract: An emulsifier for emulsion polymerization contains a compound represented by the following general formula (I).Type: ApplicationFiled: January 9, 2013Publication date: January 8, 2015Inventors: Asako Ogasawara, Masayuki Hashimoto
-
Publication number: 20140323753Abstract: An emulsifier for emulsion polymerization contains a compound represented by the following general formula (I).Type: ApplicationFiled: July 9, 2014Publication date: October 30, 2014Inventors: Asako OGASAWARA, Masayuki HASHIMOTO