Patents by Inventor Asami MASUDA

Asami MASUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11890797
    Abstract: A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm3.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 6, 2024
    Assignee: CHONGQING BOMAN NEW MATERIAL CO., LTD.
    Inventors: Katsutoshi Yamamoto, Michiko Sawai, Asami Masuda, Shigemi Oikawa
  • Publication number: 20210402665
    Abstract: A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm3.
    Type: Application
    Filed: November 11, 2019
    Publication date: December 30, 2021
    Inventors: Katsutoshi YAMAMOTO, Michiko SAWAI, Asami MASUDA, Shigemi OIKAWA