Abstract: An apparatus configured to fly a light-absorbing material, includes a unit configured to irradiate a light-absorbing material absorbing light with a laser beam corresponding to a light absorption wavelength of the light-absorbing material to fly the light-absorbing material. When a preceding beam radiation region and a following beam radiation region overlap, the following beam radiation region is irradiated with the laser beam such that a beam centroid position is outside the preceding beam radiation region.

Abstract: A substrate having a first pattern formed on a surface or in an inside of the substrate, or on the surface and in the inside of the substrate, wherein the first pattern is constituted by an aggregate of second patterns.

Abstract: An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

Abstract: Disclosed is a three-dimensional object shaping apparatus for forming an object with a desired shape in a three-dimensional space represented by a three-dimensional orthogonal coordinate system of XYZ. The three-dimensional object shaping apparatus includes a light source; a drive mechanism to move the shaping surface parallel to an XY plane in a Z axis direction; an optical scanning unit to scan light emitted from the light source along a Y axis direction perpendicular to the Z axis; and a rotation mechanism to rotate one of the optical scanning unit and the shaping surface relative to each other with respect to the Z axis as a rotation axis, where a pattern of the light to be applied to the shaping surface is controlled by a combination of a rotation of the shaping surface performed by the rotation mechanism and the scanning of the light performed by the optical scanning unit.

Abstract: A device for applying at least a first energy to a substrate includes a conversion material application unit configured to apply a conversion material for converting a second energy to the first energy to the substrate and an energy application unit configured to apply the second energy to the conversion material applied to the substrate, wherein the second energy corresponds to an amount of heat not less than heat of evaporation of the conversion material.

Abstract: An apparatus configured to model a three-dimensional modeled object, includes a carrier, an energy applying unit, and a flying unit. The carrier is configured to carry a modeling material. The energy applying unit is configured to apply energy to a surface of a modeled object. The flying unit is configured to fly the modeling material carried on the carrier toward the surface of the modeled object, the energy being applied to the surface.

Abstract: An apparatus includes a light emitter configured to emit multiple light beams including at least a first light beam and a second light beam, and an optical scanner configured to scan the multiple light beams. The light emitter is configured to cause an irradiation target to fly by using the first light beam among the multiple light beams.

Abstract: An apparatus configured to fly a light-absorbing material, includes a unit configured to irradiate a light-absorbing material absorbing light with a laser beam corresponding to a light absorption wavelength of the light-absorbing material to fly the light-absorbing material. When a preceding beam radiation region and a following beam radiation region overlap, the following beam radiation region is irradiated with the laser beam such that a beam centroid position is outside the preceding beam radiation region.

Abstract: An optical processing apparatus includes a light source, a condensing lens, and a light shield. The light source emits a light. The condensing lens converts a light emitted from the light source into a Bessel beam and condenses the light onto a surface of an object. The light shield shields an outer edge portion of the light in a cross section of a direction orthogonal to the optical axis of the light. The light shield may shield the outer edge portion of the light after entering the condensing lens and before condensing onto the surface of the object in the cross section of the direction orthogonal to the optical axis of the light.

Abstract: Disclosed is a three-dimensional object shaping apparatus for forming an object with a desired shape in a three-dimensional space represented by a three-dimensional orthogonal coordinate system of XYZ. The three-dimensional object shaping apparatus includes a light source; a drive mechanism to move the shaping surface parallel to an XY plane in a Z axis direction; an optical scanning unit to scan light emitted from the light source along a Y axis direction perpendicular to the Z axis; and a rotation mechanism to rotate one of the optical scanning unit and the shaping surface relative to each other with respect to the Z axis as a rotation axis, where a pattern of the light to be applied to the shaping surface is controlled by a combination of a rotation of the shaping surface performed by the rotation mechanism and the scanning of the light performed by the optical scanning unit.

Abstract: An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

Abstract: An optical processing apparatus includes a light source, a condensing lens, and a light shield. The light source emits a light. The condensing lens converts a light emitted from the light source into a Bessel beam and condenses the light onto a surface of an object. The light shield shields an outer edge portion of the light in a cross section of a direction orthogonal to the optical axis of the light. The light shield may shield the outer edge portion of the light after entering the condensing lens and before condensing onto the surface of the object in the cross section of the direction orthogonal to the optical axis of the light.

Abstract: An imaging unit includes an image pickup element extending along a surface parallel to an imaging surface, a circuit board including a circuit to drive the image pickup element, and a plurality of fixing members to fix the image pickup element and the circuit board. The circuit board includes at least one through hole on a straight line that extends in a longitudinal direction of the image pickup element and is provided with the plurality of the fixing members. The through hole is provided at a position between at least two of the plurality of the fixing members on the straight line.

Abstract: An imaging unit includes an image pickup element extending along a surface parallel to an imaging surface, a circuit board including a circuit to drive the image pickup element, and a plurality of fixing members to fix the image pickup element and the circuit board. The circuit board includes at least one through hole on a straight line that extends in a longitudinal direction of the image pickup element and is provided with the plurality of the fixing members. The through hole is provided at a position between at least two of the plurality of the fixing members on the straight line.

Abstract: An objective is to achieve a positional change measurement device which measures positional change of a dynamic measured surface by using speckle patterns while easily reducing influence of fluctuations in a measurement environment temperature. Provided is a positional change measurement device including: a light source; an illuminating optical system configured to guide light from the light source to a measured surface; an imaging optical system; an image pickup device configured to acquire a speckle pattern by receiving reflection light from the measured surface via the imaging optical system; and detected-length compensation means for compensating for fluctuations in a detected length caused by temperature fluctuations. Positional change of the measured surface is measured based on a result of cross-correlation computation performed on multiple speckle patterns acquired at predetermined time intervals.

Abstract: An objective is to achieve a positional change measurement device which measures positional change of a dynamic measured surface by using speckle patterns while easily reducing influence of fluctuations in a measurement environment temperature. Provided is a positional change measurement device including: a light source; an illuminating optical system configured to guide light from the light source to a measured surface; an imaging optical system; an image pickup device configured to acquire a speckle pattern by receiving reflection light from the measured surface via the imaging optical system; and detected-length compensation means for compensating for fluctuations in a detected length caused by temperature fluctuations. Positional change of the measured surface is measured based on a result of cross-correlation computation performed on multiple speckle patterns acquired at predetermined time intervals.