Abstract: In a method of continuously plating wire electrolytically, acid crystal and liquid residues originating from the plating bath form on the wire. In order to remove these residues from the surface of the wire, the method of the invention comprises mechanically treating the surface of the wire while supplying a liquid to the wire prior to the mechanical treatment. The wire undergoes treating in the presence of the supplied liquid and the composition of the liquid and residues in such that the residues are not dissolved or emulgated in the liquid. The liquid with the residues can be collected and the residues separated from the liquid so that the liquid can be recycled back to the stage of mechanical treatment of the wire in a closed circuit.