Abstract: Equipment and network resources are automatically tested in advance of scheduled telepresence meetings in order to discover problems before the actual telepresence meeting. When a meeting between telepresence sites is scheduled, a test time is automatically scheduled for performing a test in advance of a scheduled time of the telepresence meeting. At the test time, performing the test to determine whether equipment functions at telepresence sites involved in the telepresence meeting and network resource availability are sufficient to support the telepresence meeting.

Abstract: Equipment and network resources are automatically tested in advance of scheduled telepresence meetings in order to discover problems before the actual telepresence meeting. When a meeting between telepresence sites is scheduled, a test time is automatically scheduled for performing a test in advance of a scheduled time of the telepresence meeting. At the test time, performing the test to determine whether equipment functions at telepresence sites involved in the telepresence meeting and network resource availability are sufficient to support the telepresence meeting.

Abstract: A system and method for removing photoresist or other organic compounds from semiconductor wafers is provided. Non-fluorinated reactant gases (O2, H2, H2O, N2 etc.) are activated in a quartz tube by a medium pressure surface wave discharge. As the plasma jet impinges on a substrate, volatile reaction products (H2O, CO2, or low molecular weight hydrocarbons) selectively remove the photoresist from the surface. The medium pressure also enables high gas temperatures that provide an effective source of heat in the reactive zone on the wafer that enhances etch rates and provides a practical means of removing ion implanted photoresist.

Abstract: A plasma processing system includes at least one multi-piece baffle plate. The multi-piece baffle plate assembly generally comprises at least one annular shaped ring portion having an opening and an insert portion dimensioned to sit within the opening. The individual pieces can be formed of a ceramic material. The effects caused by thermal gradients in the plate during plasma processing are minimized.

Abstract: A baffle plate assembly for distributing gas flows into an adjacent process chamber containing a semiconductor wafer to be processed includes a planar gas distribution portion having a plurality of apertures therein; a flange surrounding the gas distribution portion; and an impingement device centrally attached to the gas distribution portion, wherein the device includes a cap and a stem, the stem being in thermal contact with the gas distribution portion. Also disclosed herein are plasma reactors employing the baffle plate assembly and methods for reducing recombination of species in a plasma.