Abstract: An implantable medical device includes a header body and a septum assembly. The header body includes a first welding surface and a septum bore extending inwardly from an outer surface to an inner cavity. The septum assembly is at least partially disposed within the septum bore of the header assembly and includes a septum configured to allow insertion of a tool through the septum into the inner cavity and to otherwise provide a seal. The septum assembly further includes a retainer within which at least a portion of the septum is retained. The retainer includes a welding feature coupled to the retainer body, the welding feature providing a second welding surface. The retainer is coupled to the header body by welding the first welding surface to the second welding surface.

Abstract: An implantable medical device includes a header body and a septum assembly. The header body includes a first welding surface and a septum bore extending inwardly from an outer surface to an inner cavity. The septum assembly is at least partially disposed within the septum bore of the header assembly and includes a septum configured to allow insertion of a tool through the septum into the inner cavity and to otherwise provide a seal. The septum assembly further includes a retainer within which at least a portion of the septum is retained. The retainer includes a welding feature coupled to the retainer body, the welding feature providing a second welding surface. The retainer is coupled to the header body by welding the first welding surface to the second welding surface.

Abstract: An implantable medical device includes a header body and a septum assembly. The header body includes a first welding surface and a septum bore extending inwardly from an outer surface to an inner cavity. The septum assembly is at least partially disposed within the septum bore of the header assembly and includes a septum configured to allow insertion of a tool through the septum into the inner cavity and to otherwise provide a seal. The septum assembly further includes a retainer within which at least a portion of the septum is retained. The retainer includes a welding feature coupled to the retainer body, the welding feature providing a second welding surface. The retainer is coupled to the header body by welding the first welding surface to the second welding surface.

Abstract: A pulse generator comprises a header connector assembly coupled with a housing. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The connector assembly includes an electrically insulative segment, a first electrically conductive segment, and a second electrically conductive segment axially spaced apart from the first electrically conductive segment by the electrically insulative segment. Each electrically conductive segment includes a connector ring, a spring housing and a spring supported by the spring housing. The connector ring and spring housing are in electrical communication with each other. The electrically insulative segment includes an insulator ring that is positioned between the first and second electrically conductive segments. The insulator ring includes a first end and a second end axially opposite the first end.

Abstract: Disclosed herein is an implantable electronic device for use with implantable medical leads. The implantable medical leads are retained within the implantable electronic device with coated setscrews and, in particular, setscrews having a vapor-deposited coating, such as parylene. The coated setscrews have improved thread locking capabilities that resist unscrewing once tightened and, as a result, improve retention of implantable leads within the implantable electronic device.

Abstract: Disclosed herein is an implantable electronic device for use with implantable medical leads. The implantable medical leads are retained within the implantable electronic device with coated setscrews and, in particular, setscrews having a vapor-deposited coating, such as parylene. The coated setscrews have improved thread locking capabilities that resist unscrewing once tightened and, as a result, improve retention of implantable leads within the implantable electronic device.

Abstract: The present disclosure provides medical devices and methods of manufacturing medical devices wherein the medical device includes at least one bonding surface that has been roughed by laser etching to increase its surface area and improve its bonding characteristics. In many embodiments, the medical device is an implantable medical device that includes a hermetically sealed metallic housing that is bonded to a prefabricated non-metallic header. The hermetically sealed metallic housing includes at least one surface that has been subjected to a laser etching and roughening process to increase its surface area and improve its bonding characteristics. The laser etched surface may include spots created in a non-overlapping honeycomb-type pattern that may additionally include a series of spikes protruding therefrom to further improve bonding characteristics.

Abstract: The present disclosure provides medical devices and methods of manufacturing medical devices wherein the medical device includes at least one bonding surface that has been roughed by laser etching to increase its surface area and improve its bonding characteristics. In many embodiments, the medical device is an implantable medical device that includes a hermetically sealed metallic housing that is bonded to a prefabricated non-metailic header. The hermetically sealed metallic housing includes at least one surface that has been subjected to a laser etching and roughening process to increase its surface area and improve its bonding characteristics. The laser etched surface may include spots created in a non-overlapping honeycomb-type pattern that may additionally include a series of spikes protruding therefrom to further improve bonding characteristics.

Abstract: A pulse generator comprises a header connector assembly coupled with a housing. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The connector assembly includes an electrically insulative segment, a first electrically conductive segment, and a second electrically conductive segment axially spaced apart from the first electrically conductive segment by the electrically insulative segment. Each electrically conductive segment includes a connector ring, a spring housing and a spring supported by the spring housing. The connector ring and spring housing are in electrical communication with each other. The electrically insulative segment includes an insulator ring that is positioned between the first and second electrically conductive segments. The insulator ring includes a first end and a second end axially opposite the first end.

Abstract: Disclosed herein is an implantable pulse generator for administering electrotherapy via an implantable lead. The pulse generator includes a housing and a header connector assembly. The housing includes a first portion of a cam lock arrangement. The header connector assembly includes a connector assembly, a header enclosing the connector assembly, and a second portion of the cam lock system cam locked with the first portion in anchoring the header connector assembly to the housing.

Abstract: Disclosed herein is a resistance welding system for welding a ribbon to a bond site of a bond surface. The system includes a welding header, a bond header, a ribbon dispenser, a cutter, and a support surface. The welding header includes a resistance welding tip. The bond header includes a bond foot displaceable relative to the bond surface. The bond foot includes a welding aperture. The ribbon dispenser feeds the ribbon to the bond foot. The support surface is configured to support the bond surface. The bond foot is configured to press the ribbon against the bond site of the bond surface, which is thereby forced against the support surface. With the ribbon so pressed against the bond site, the system is configured to cause the welding tip to enter the welding aperture to resistance weld the ribbon to the bond site of the bond surface.

Abstract: Disclosed herein are electronic devices, such as, for example, televisions, stereo systems, diagnostic equipment, cell phones, desktop or laptop PCs, medical pulse generators, or etc., including an integrated circuit including a printed circuit board including multiple layers and a wire bond pad. The multiple layers are sandwiched together in a planar unitary structure including a top surface, a bottom surface and a structure edge extending between the top surface and the bottom surface. The multiple layers include a first organic substrate layer joined to a second organic substrate layer. Each organic substrate layer includes a layer edge and a peripheral surface adjacent the layer edge. Each layer edge forms part of the structure edge. The wire bond pad includes an outer face, an inner face generally opposite the outer face, and a first rib. The inner face extends along the structure edge.