Patents by Inventor Ashay A. Dadi

Ashay A. Dadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140225265
    Abstract: Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.
    Type: Application
    Filed: March 29, 2012
    Publication date: August 14, 2014
    Inventors: Rajen S. Sidhu, Ashay A. Dadi, Martha A. Dudek