Patents by Inventor Ashim Shatil Haque
Ashim Shatil Haque has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11313996Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.Type: GrantFiled: January 14, 2021Date of Patent: April 26, 2022Assignee: Lumileds LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Publication number: 20210132263Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.Type: ApplicationFiled: January 14, 2021Publication date: May 6, 2021Inventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Patent number: 10895669Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.Type: GrantFiled: September 16, 2019Date of Patent: January 19, 2021Assignee: Lumileds LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Publication number: 20200116902Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.Type: ApplicationFiled: September 16, 2019Publication date: April 16, 2020Applicant: Lumileds LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Patent number: 10416356Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.Type: GrantFiled: January 4, 2015Date of Patent: September 17, 2019Assignee: Lumileds, LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Patent number: 10379263Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.Type: GrantFiled: January 4, 2015Date of Patent: August 13, 2019Assignee: Lumileds, LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Patent number: 10355182Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.Type: GrantFiled: March 6, 2014Date of Patent: July 16, 2019Assignee: LUMILEDS LLCInventors: Walter Daeschner, Frederic Stephane Diana, Mohiuddin Mala, Ashim Shatil Haque, Mark Melvin Butterworth
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Publication number: 20170301841Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.Type: ApplicationFiled: July 1, 2017Publication date: October 19, 2017Applicant: Lumileds LLCInventors: Stephen Andrew Stockman, Marc Andre de Samber, Oleg Borisovich Shchekin, Norbertus Antonius Maria Sweegers, Ashim Shatil Haque, Yourii Martynov
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Patent number: 9698323Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.Type: GrantFiled: August 28, 2014Date of Patent: July 4, 2017Assignee: Koninklijke Philips N.V.Inventors: Stephen Andrew Stockman, Marc Andre de Samber, Oleg Borisovich Shchekin, Norbertus Antonius Maria Sweegers, Ashim Shatil Haque, Yourii Martynov
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Publication number: 20160341852Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.Type: ApplicationFiled: January 4, 2015Publication date: November 24, 2016Inventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Publication number: 20160240755Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.Type: ApplicationFiled: August 28, 2014Publication date: August 18, 2016Inventors: Stephen Andrew Stockman, Marc Andre de Samber, Oleg Borisovich Shchekin, Norbertus Antonius Maria Sweegers, Ashim Shatil Haque, Yourii Martynov
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Publication number: 20160172554Abstract: Intermediate removable placement and processing structures are provided to enable the formation of optical elements upon light emitting elements, including the formation of a reflective layer beneath the optical elements. These removable placement and processing structures are substantially independent of the particular dimensions of the produced light emitting device, allowing their re-use in a variety of applications. The resultant light emitting device includes the light emitting element,the optical element with reflector, and, optionally, a wavelength conversion material, but does not include remnants of the placement and processing structures, such as a carrier substrate.Type: ApplicationFiled: July 17, 2014Publication date: June 16, 2016Inventors: Grigoriy Basin, Ashim Shatil Haque, Hideo Kageyama, Brendan Jude Moran, Jyoli Kiron Bhardwaj
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Publication number: 20160049561Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.Type: ApplicationFiled: March 6, 2014Publication date: February 18, 2016Inventors: WALTER DAESCHNER, FREDERIC STEPHANE DIANA, MOHIUDDIN MALA, ASHIM SHATIL HAQUE, MARK MELVIN BUTTERWORTH
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Patent number: 7791093Abstract: In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.Type: GrantFiled: September 4, 2007Date of Patent: September 7, 2010Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLCInventors: Grigoriy Basin, Ashim Shatil Haque, Ching-hui Chen, Robert Scott West, Paul Martin
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Publication number: 20100207140Abstract: A method of forming a light emitting diode (LED) module molds an array of lens support frames over an array of connected lead frames. LEDs are bonded to the lead frame contacts within the support frames. Molded lenses are then affixed over each support frame, and the lead frames are diced to create individual LED modules. In another embodiment, the lenses are molded along with the support frames to create unitary pieces, and the support frames are affixed to the lead frames in the array of connected lead frames. In another embodiment, no lenses are used, and cups are molded with the lead frames so that the LED module is formed solely of the unitary lead frame/cup and the LED. Since each LED enclosure is formed of only one or two separate pieces, and the modules are fabricated on an array scale, the modules can be made very small and simply.Type: ApplicationFiled: February 19, 2009Publication date: August 19, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Serge Laurent RUDAZ, Serge BIERHUIZEN, Ashim Shatil HAQUE
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Publication number: 20090057699Abstract: In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.Type: ApplicationFiled: September 4, 2007Publication date: March 5, 2009Applicant: PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: Grigoriy Basin, Ashim Shatil Haque, Ching-hui Chen, Robert Scott West, Paul Martin
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Publication number: 20080142833Abstract: A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer formed on the mount or a metal layer formed on one of the contacts. The plated metal layer may replace other known interconnecting techniques such as stud bumps. The semiconductor light emitting device is physically connected to the mount by causing interdiffusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.Type: ApplicationFiled: February 11, 2008Publication date: June 19, 2008Applicant: PHILIPS LUMILEDS LIGHTING COMPANY LLCInventors: Stefano Schiaffino, Ashim Shatil Haque, Paul S. Martin, Daniel A. Steigerwald, Decai Sun
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Patent number: 7348212Abstract: A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer formed on the mount or a metal layer formed on one of the contacts. The plated metal layer may replace other known interconnecting techniques such as stud bumps. The semiconductor light emitting device is physically connected to the mount by causing interdiffusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.Type: GrantFiled: September 13, 2005Date of Patent: March 25, 2008Assignee: Philips Lumileds Lighting Company LLCInventors: Stefano Schiaffino, Ashim Shatil Haque, Paul S. Martin, Daniel A. Steigerwald, Decai Sun