Abstract: An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.

Abstract: An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

Abstract: An image sensor has at least two photodiodes in each unit pixel. A high dynamic range is achieved by selecting different exposure times for the photodiodes. Additionally, blooming is reduced. The readout timing cycle is chosen so that the short exposure time photodiodes act as drains for excess charge overflowing from the long exposure time photodiodes. To improve draining of excess charge, the arrangement of photodiodes may be further selected so that long exposure time photodiodes are neighbored along vertical and horizontal directions by short exposure time photodiodes. A micro-lens array may also be provided in which light is preferentially coupled to the long exposure time photodiodes to improve sensitivity.

Abstract: An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

Abstract: Methods and apparatus for electron beam treatment of a substrate are provided. An electron beam apparatus that includes a vacuum chamber, at least one thermocouple assembly in communication with the vacuum chamber, a heating device in communication with the vacuum chamber, and combinations thereof are provided. In one embodiment, the vacuum chamber comprises an electron source wherein the electron source comprises a cathode connected to a high voltage source, an anode connected to a low voltage source, and a substrate support. In another embodiment, the vacuum chamber comprises a grid located between the anode and the substrate support. In one embodiment the heating device comprises a first parallel light array and a second light array positioned such that the first parallel light array and the second light array intersect. In one embodiment the thermocouple assembly comprises a temperature sensor made of aluminum nitride.

Abstract: The traditional method of building a CFx/current collector/SVO assembly is by the application of a static pressing force. However, the density of the electrode and, particularly the CFx component, can be increase by using a cyclic pressing protocol. That is where the active materials are formed into a blank or contacted to a current collector by the use of at least two pressing events separated by a period when the pressure is removed. Not only does this cyclic pressing protocol increase the density of the CFx material, it also provides an electrode that is relatively flat, and not cupped. Conventional pressing techniques often result in badly cupped electrodes, especially when disparate active materials are contacting opposite sides of the current collector. Cupping consequently reduces the effective volumetric energy density of the electrode or necessitates the addition of a process step of flattening of the cathode, if at all possible.

Abstract: Several embodiments of the present invention employ synchronization adapters for synchronizing information between “WinFS” and non-“WinFS” data sources. Examples of adapters include an adapter that synchronizes address book information between a “WinFS” contacts folder and a non-WinFS mailbox. In these instances, adapter developers might use the “WinFS” synchronization core services API described herein for accessing services provided by the “WinFS” synchronization platform in order to develop schema transformation code between the “WinFS” schema and the non-“WinFS” data source schema. Additionally, the adapter developer provides protocol support for communicating changes with the non-“WinFS” data source. A synchronization adapter is invoked and controlled by using the synchronization controller API and reports progress and errors using this API.

Abstract: Deposition of an electrode active material printing suspension onto a conductive substrate by various pad-printing techniques is described. After heat-treating to evaporate the solvent and decompose a printing binder, an electrode active coating suitable for incorporation into an electrochemical cell is provided.

Abstract: An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and an embedded layer. The optical sensor is disposed within a semiconductor substrate. The stack of dielectric and metal layers are disposed on the front side of the semiconductor substrate above the optical sensor region. The embedded focusing layer is disposed on the backside of the semiconductor substrate in a Backside Illuminated (BSI) image sensor, supported by a support grid, or a support grid composed of the semiconductor substrate.

Abstract: A storage virtualization system for accessing at least one storage device for a virtual logical unit (VLUN) from at least one host. The system includes at least one upstream processing element (UPE) which is adapted for coupling to a corresponding host server. The system is further adapted for coupling to at least one storage device. The controller also includes a primary central processing element (CPE) that can be configurably coupled to the UPEs. The primary CPE permits data transfer to occur between a host and a storage device via the corresponding UPE. The controller further includes a backup CPE that can be configurably coupled to the UPEs. The backup CPE is configurable to permit the data transfer when the primary CPE becomes unavailable.

Abstract: An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and a buried focusing layer. The optical sensor is disposed within a semiconductor substrate. The stack of dielectric and metal layers are disposed on the semiconductor substrate above the optical sensor region. The metal layers include optical pass-throughs aligned to expose an optical path through the stack form a top dielectric layer through to the optical sensor region. The buried focusing layer is disposed over a conforming metal layer of the metal layers within the stack. The buried focusing layer includes a curved surface conformed by the optical pass-through of the conforming metal layer to focus light onto the optical sensor region.

Abstract: An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and a buried focusing layer. The optical sensor is disposed within a semiconductor substrate. The stack of dielectric and metal layers are disposed on the semiconductor substrate above the optical sensor region. The metal layers include optical pass-throughs aligned to expose an optical path through the stack form a top dielectric layer through to the optical sensor region. The buried focusing layer is disposed over a conforming metal layer of the metal layers within the stack. The buried focusing layer includes a curved surface conformed by the optical pass-through of the conforming metal layer to focus light onto the optical sensor region.

Abstract: An image sensor includes at least one photosensitive element disposed in a semiconductor substrate. Metal conductors may be disposed on the semiconductor substrate. A filter may be disposed between at least two individual metal conductors and a micro-lens may be disposed on the filter. There may be insulator material disposed between the metal conductors and the semiconductor substrate and/or between individual metal conductors. The insulator material may be removed so that the filter may be disposed on the semiconductor substrate.

Abstract: Pesticide concentrates are provided containing an emulsifier that is an EPA list 4 inert and is a polyglycerol fatty acid ester, a sorbitan fatty acid ester or a combination thereof, a pesticide and a solvent that is either a EPA list 3 inert of acetyl ester, EPA list 4 inert of a methyl fatty ester, an acetyltributyl citrate, white mineral oil or a combination thereof. The pesticide can be a water-insoluble synthetic pyrethroid, natural pyrethrum, channel blocking insecticide, acetylcholinesterase inhibitor, oxadiazine, organophosphate, neonicotinoid insecticide, thiamethoxam, imidacloprid, acetamiprid, thiacloprid, clothianidin, nitenpyran, insect growth regulator, juvenile hormone mimic, fermentation insecticide, plant oil insecticide acaracide, miticide, fungicide, herbicide and combinations thereof. The pesticide concentrate is diluted with a hydrocarbon solvent, a white mineral oil or a combination thereof and mixed with water.

Abstract: An electrochemical cell comprising a casing, an anode comprising anode active material, a cathode, and an electrolyte solution activating the cathode and the anode is described. In one embodiment, the cathode is comprised of a first current collector, first and second sheets of a first cathode active material in contact with the first current collector, a second current collector, third and forth sheets of the first cathode active material in contact with the second current collector, and a first sheet of a second cathode active material in non-adherent and congruent contact with the second and third sheets of the first cathode active material.

Abstract: Various embodiments of the present invention are directed to conflict handling for conflicts that occur in a peer-to-peer synchronization system, where the ability to correctly and efficiently handle conflicts minimizes data loss while retaining good usability and reduces the need for user intervention during synchronization. Conflict handling in the synchronization service is divided into three stages: (1) conflict detection; (2) automatic conflict resolution and logging; and (3) conflict inspection and resolution.

Abstract: An electrochemical cell comprising a conductive casing housing an electrode assembly provided with a stack holder surrounding the electrode assembly is described. The stack holder is of an elastic material that serves to maintain the anode and cathode in a face-to-face alignment throughout discharge. This is particularly important in later stages of cell life. As the cell discharges, anode active material is physically moved from the anode to intercalate with the cathode active material. As this mass transfer occurs, the cathode becomes physically larger and the anode smaller. This can lead to misalignment. However, the stack holder prevents such misalignment by maintaining a constrictive force on the electrode assembly throughout discharge.

Abstract: The present invention comprises an apparatus and method for etching at a substrate edge region. In one embodiment, the apparatus comprises a chamber having a process volume, a substrate support arranged inside the process volume and having a substrate support surface, a plasma generator coupled to the chamber and configured to supply an etching agent in a plasma phase to a peripheral region of the substrate support surface, and a gas delivery assembly coupled to a gas source for generating a radial gas flow over the substrate support surface from an approximately central region of the substrate support surface toward the peripheral region of the substrate support surface.

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.