Patents by Inventor Ashish Alawani

Ashish Alawani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210098320
    Abstract: A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 1, 2021
    Inventors: Daniel GARCIA, Kinfegebriel Amera MENGISTIE, Francesco CARRARA, Chang-Ho LEE, Ashish ALAWANI, Mark KUHLMAN, John Jong-Hoon LEE, Jeongkeun KIM, Xiaoju YU, Supatta NIRAMARNKARN
  • Patent number: 10141268
    Abstract: A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound. The first electronic component includes a first die substrate with first electronic circuitry that generates electromagnetic radiation. The second electronic component includes a second die substrate with second electronic circuitry. The internal shield is electrically connected to ground and substantially covers a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the electromagnetic radiation generated by the first electronic circuitry. The molded compound is disposed over the substrate and the first and second electronic components, and the external shield is disposed on at least one outer surface of the circuit package and electrically connected to ground.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: November 27, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Domingo Figueredo, Husnu Masaracioglu, Marshall Maple, Deog-Soon Choi, Ashish Alawani
  • Patent number: 10134682
    Abstract: A module includes a circuit package having multiple electronic components on a substrate, a molded compound disposed over the substrate and the electronic components, and an external shield disposed on at least one outer surface of the circuit package. The external shield is segmented into multiple external shield partitions that are grounded, respectively. Adjacent external shield partitions of the multiple external shield partitions are separated by a corresponding gap located between adjacent electronic components of the multiple electronic components. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress. Each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: November 20, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani, Li Sun
  • Patent number: 10021790
    Abstract: A module includes a PCB including a substrate, a component pad and at least one wire pad, an SMT component mounted to a component pad, a wire fence, a mold compound and a top conductive layer. Each wire pad is connected to ground by a corresponding via extending through the substrate, and the wire fence includes wire loops connected to each wire pad. The mold compound is disposed over the PCB, the SMT component and the wire fence, and defines multiple holes extending partially through the mold compound to top-edges of the wire loops, respectively, where a conductive material fills the holes. The top conductive layer is disposed over the mold compound, and is in electrical contact with the conductive material filling the holes. The wire fence, the conductive material, and the top conductive layer provide shielding of the SMT component from electromagnetic radiation.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 10, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Jin Jeong, Chris Chung, Nitesh Kumbhat, Ashish Alawani
  • Patent number: 9997428
    Abstract: An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: June 12, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Marshall Maple, Ashish Alawani, Li Sun, Sarah Haney
  • Patent number: 9865479
    Abstract: A method is provided for attaching components to pads on a PCB, where total accumulated tolerances are reduced by separating accumulated tolerances into multiple processes. The method includes performing first and second processes having first and second accumulated tolerances, respectively. The first process includes placing a first stencil over the PCB, the first stencil defining first apertures corresponding to the pads; printing solder paste onto the pads using the first stencil; and reflowing the printed solder paste to form corresponding solder bumps on the pads. The second process includes placing a second stencil over the PCB, the second stencil defining second apertures corresponding to the pads; printing flux onto the solder bumps using the second stencil; placing at least one component on the printed flux; and reflowing the printed flux and the solder bumps to form corresponding solder joints between the at least one component and the first pads, respectively.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: January 9, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Wei-Shun Wang, Li Sun, Ashish Alawani, Lea-Teng Lee
  • Publication number: 20170301559
    Abstract: A method is provided for attaching components to pads on a PCB, where total accumulated tolerances are reduced by separating accumulated tolerances into multiple processes. The method includes performing first and second processes having first and second accumulated tolerances, respectively. The first process includes placing a first stencil over the PCB, the first stencil defining first apertures corresponding to the pads; printing solder paste onto the pads using the first stencil; and reflowing the printed solder paste to form corresponding solder bumps on the pads. The second process includes placing a second stencil over the PCB, the second stencil defining second apertures corresponding to the pads; printing flux onto the solder bumps using the second stencil; placing at least one component on the printed flux; and reflowing the printed flux and the solder bumps to form corresponding solder joints between the at least one component and the first pads, respectively.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 19, 2017
    Inventors: Wei-Shun Wang, Li Sun, Ashish Alawani, Lea-Teng Lee
  • Publication number: 20170251576
    Abstract: A module includes a PCB including a substrate, a component pad and at least one wire pad, an SMT component mounted to a component pad, a wire fence, a mold compound and a top conductive layer. Each wire pad is connected to ground by a corresponding via extending through the substrate, and the wire fence includes wire loops connected to each wire pad. The mold compound is disposed over the PCB, the SMT component and the wire fence, and defines multiple holes extending partially through the mold compound to top-edges of the wire loops, respectively, where a conductive material fills the holes. The top conductive layer is disposed over the mold compound, and is in electrical contact with the conductive material filling the holes. The wire fence, the conductive material, and the top conductive layer provide shielding of the SMT component from electromagnetic radiation.
    Type: Application
    Filed: February 26, 2016
    Publication date: August 31, 2017
    Inventors: Jin Jeong, Chris Chung, Nitesh Kumbhat, Ashish Alawani
  • Publication number: 20170223839
    Abstract: A method is provided for fabricating an electromagnetic shield for an electronic component on a PCB. The method includes providing a patterned metal layer; laminating the patterned metal layer with a second dielectric layer; forming a cavity in the second dielectric layer; applying a dry film resist over the second dielectric layer and the cavity; stripping the dry film resist from the second dielectric layer and portions of the cavity adjacent the cavity side walls; depositing a seed layer and metal over the second dielectric layer and the dry film resist; etching the preplating layer and the seed layer from top surfaces of a remainder of the dry film resist and the second dielectric layer; and stripping the remainder of the dry film resist, thereby exposing the preplating layer on the side walls of the cavity to provide the electromagnetic shield.
    Type: Application
    Filed: January 28, 2016
    Publication date: August 3, 2017
    Inventors: Padam Jain, Sarah Haney, Ashish Alawani
  • Publication number: 20170127581
    Abstract: A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound. The first electronic component includes a first die substrate with first electronic circuitry that generates electromagnetic radiation. The second electronic component includes a second die substrate with second electronic circuitry. The internal shield is electrically connected to ground and substantially covers a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the electromagnetic radiation generated by the first electronic circuitry. The molded compound is disposed over the substrate and the first and second electronic components, and the external shield is disposed on at least one outer surface of the circuit package and electrically connected to ground.
    Type: Application
    Filed: October 30, 2015
    Publication date: May 4, 2017
    Inventors: Domingo Figueredo, Husnu Masaracioglu, Marshall Maple, Deog-Soon Choi, Ashish Alawani
  • Publication number: 20170118877
    Abstract: A module includes a circuit package having multiple electronic components on a substrate, at least one bond wire extending from the substrate between adjacent electronic components of the multiple electronic components, and a molded compound disposed over the substrate, the electronic components, and the at least one bond wire. The at least one bond wire provides a corresponding internal shield, electrically connected to ground and configured to shield one of the adjacent electronic components, between which the at least one bond wire extends, from electromagnetic radiation generated by the other of the adjacent electronic components.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 27, 2017
    Inventors: Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani, Li Sun
  • Publication number: 20170117229
    Abstract: A module includes a circuit package, which includes multiple electronic components on a substrate, a molded compound. The molded compound is disposed over the substrate and the electronic components, and defines at least one trench feature, at least a portion of which is during application of the molded compound. The trench feature extends from a top surface of the molded compound toward the substrate between adjacent electronic components. An external shield may be disposed on at least one outer surface of the circuit package and is electrically connected to ground for protecting the circuit package from external electromagnetic radiation and environmental stress. The trench feature includes an electrically conductive material that provides an internal shield, electrically connected to ground and configured to shield one of the adjacent electronic components, between which the trench feature extends, from electromagnetic radiation generated by the other adjacent electronic component.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 27, 2017
    Inventors: Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani, Li Sun
  • Publication number: 20170117230
    Abstract: A module includes a circuit package having multiple electronic components on a substrate, a molded compound disposed over the substrate and the electronic components, and an external shield disposed on at least one outer surface of the circuit package. The external shield is segmented into multiple external shield partitions that are grounded, respectively. Adjacent external shield partitions of the multiple external shield partitions are separated by a corresponding gap located between adjacent electronic components of the multiple electronic components. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress. Each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 27, 2017
    Inventors: Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani, Li Sun
  • Publication number: 20170018478
    Abstract: An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 19, 2017
    Inventors: Marshall Maple, Ashish Alawani, Li Sun, Sarah Haney
  • Publication number: 20170018501
    Abstract: An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
    Type: Application
    Filed: October 31, 2015
    Publication date: January 19, 2017
    Inventors: Marshall Maple, Ashish Alawani, Li Sun, Sarah Haney, Lea-Teng Lee, Wei Yao
  • Patent number: 8946904
    Abstract: A substrate comprising a plurality of layers, a first side and a second side; and a via extending through the substrate from the first side to the second side. The via comprises:a first substrate via extending through a first layer of the plurality of layers, the first substrate via having a first cross-sectional area; a first capture pad disposed under the first substrate via, wherein the first capture pad physically contacts the first substrate via; a second substrate via extending through a second layer of the plurality of layers, the second substrate via physically contacting the first capture pad, the second substrate via having a second cross-sectional area that is greater than the first cross-sectional area; and a second thermal and electrical contact pad disposed under the second dielectric layer, wherein the second contact pad physically contacts the second substrate via.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: February 3, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Tarak A. Railkar, Ashish Alawani, Ray Parkhurst
  • Publication number: 20120049345
    Abstract: A substrate comprising a plurality of layers, a first side and a second side; and a via extending through the substrate from the first side to the second side. The via comprises: a first substrate via extending through a first layer of the plurality of layers, the first substrate via having a first cross-sectional area; a first capture pad disposed under the first substrate via, wherein the first capture pad physically contacts the first substrate via; a second substrate via extending through a second layer of the plurality of layers, the second substrate via physically contacting the first capture pad, the second substrate via having a second cross-sectional area that is greater than the first cross-sectional area; and a second thermal and electrical contact pad disposed under the second dielectric layer, wherein the second contact pad physically contacts the second substrate via.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 1, 2012
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Tarak A. Railkar, Ashish Alawani, Ray Parkhurst
  • Publication number: 20070257375
    Abstract: An electronic package. The electronic package includes an electronic component having a heat producing device, an attachment piece, and at least two attachment units. Each unit includes an attachment pillar having a mating surface, a solder layer formed on the mating surface, and an attachment pad located on the attachment piece. The pillar of each unit is attached to its unit attachment pad via its unit solder layer and is otherwise attached to the electronic component. One pillar at least partially covers the heat producing device. Prior to attachment of pillars to their associated unit pads, the unit solder layer of the pillar at least partially covering the heat producing device is patterned to cover less than its mating surface, and the pillar at least partially covering the heat producing device is thermally connected to the heat producing device and to its unit attachment pad via its unit solder layer.
    Type: Application
    Filed: May 2, 2006
    Publication date: November 8, 2007
    Inventors: James Roland, Ray Parkhurst, Ashish Alawani, Marshall Maple, Thu Nguyen
  • Publication number: 20050011672
    Abstract: According to one exemplary embodiment, an overmolded module comprises a surface mount component situated over a substrate, where the surface mount component comprises a first terminal and a second terminal. The overmolded module can be an MCM and the substrate can be a laminate circuit board, for example. The overmolded module further comprises a first and a second pad situated on the substrate, where the first pad is connected to the first terminal and the second pad is connected to the second terminal. According to this exemplary embodiment, the overmolded module further comprises a solder mask trench situated underneath the surface mount component, where the solder mask trench is filled with molding compound. The overmolded module further comprises a moldable gap situated between a bottom surface of the surface mount component and a top surface of the substrate, where the moldable gap includes the solder mask trench.
    Type: Application
    Filed: July 17, 2003
    Publication date: January 20, 2005
    Inventors: Ashish Alawani, Sandra Petty-Weeks, Lori DeOrio, Roberto Villanueva