Patents by Inventor Ashish X Gupta

Ashish X Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
    Patent number: 9347987
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: May 24, 2016
    Assignee: INTEL CORPORATION
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
  • Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
    Patent number: 9207274
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: December 8, 2015
    Assignee: INTEL CORPORATION
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
  • Liquid TIM dispense and removal method and assembly
    Patent number: 7982478
    Abstract: In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: July 19, 2011
    Assignee: Intel Corporation
    Inventors: Nader Abazarnia, Ashish X Gupta, Suzana Prstic
  • Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
    Publication number: 20110109335
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
  • LIQUID TIM DISPENSE AND REMOVAL METHOD AND ASSEMBLY
    Publication number: 20100164510
    Abstract: In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 1, 2010
    Inventors: Nader Abazarnia, Ashish X. Gupta, Suzana Prstic