Patents by Inventor Ashit Arvind Mehta

Ashit Arvind Mehta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally stable photoimaging composition
    Patent number: 5667934
    Abstract: A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree.C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: September 16, 1997
    Assignee: International Business Machines Corporation
    Inventors: Voya Rista Markovich, Ashit Arvind Mehta, Eugene Roman Skarvinko, David Wei Wang
  • Thermally stable photoimaging composition
    Patent number: 5665526
    Abstract: A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree. C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: September 9, 1997
    Assignee: International Business Machines Corporation
    Inventors: Voya Rista Markovich, Ashit Arvind Mehta, Eugene Roman Skarvinko, David Wei Wang