Abstract: A method of improving surface roughness of ceramic matrix composites (CMCs) is provided. The method includes completing a formation of the CMCs and a chemical vapor infiltration (CVI) process to initially coat the CMCs, inspecting a CMC surface, identifying, from a result of the inspecting, a defect in the CMC surface that negatively impacts a surface roughness characteristic thereof, locally targeting and ablating the defect and re-inspecting the CMC surface to ensure that the defect is correct.

Abstract: A method of improving surface roughness of ceramic matrix composites (CMCs) is provided. The method includes completing a formation of the CMCs and a chemical vapor infiltration (CVI) process to initially coat the CMCs, inspecting a CMC surface, identifying, from a result of the inspecting, a defect in the CMC surface that negatively impacts a surface roughness characteristic thereof, locally targeting and ablating the defect and re-inspecting the CMC surface to ensure that the defect is correct.

Abstract: A method of forming a ceramic matrix composite component according to an exemplary embodiment of this disclosure, among other possible things includes laying up plies of ceramic reinforcement material with sacrificial plies to form a preform, infiltrating the preform with a ceramic matrix material, and machining away the sacrificial plies to reveal a surface profile of the ceramic matrix composite component. A preform for a ceramic matrix composite component is also disclosed.

Abstract: A method of improving surface roughness of ceramic matrix composites (CMCs) is provided. The method includes completing a formation of the CMCs and a chemical vapor infiltration (CVI) process to initially coat the CMCs, inspecting a CMC surface, identifying, from a result of the inspecting, a defect in the CMC surface that negatively impacts a surface roughness characteristic thereof, locally targeting and ablating the defect and re-inspecting the CMC surface to ensure that the defect is correct.

Abstract: A method of machining cooling holes includes providing a workpiece in which a cooling hole is to be formed. The cooling hole, once formed, defines distinct first and second sections. The workpiece is secured in a fixture that is mounted in a first machine. In the first machine, a laser is used to drill a through-hole in a wall of the workpiece. The through-hole is spatially common to the first and second sections of the cooling hole. After drilling the through-hole, the fixture with the workpiece secured therein is removed from the first machine and mounted in a second machine. In the second machine, ultrasonic machining is used to expand a portion of the through-hole to form the second section. An abrasive slurry used in the process is drained through the through-hole during the ultrasonic machining.