Abstract: A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component.

Abstract: Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV wherein R1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R1 and R2 comprises a fluorine substituent; and n has a value of from 1 to 30.

Abstract: A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component.

Abstract: Phthalonitrile adhesive formulations are provided. Such an adhesive formulation may comprise an etherimide-phthalonitrile oligomer having formula wherein R1 is an unsubstituted or substituted aryl group or an unsubstituted or substituted cycloalkyl group; R2 is an unsubstituted or substituted aryl group and n has a value of from 1 to 30. Also provided are methods of making and using the adhesive formulations.

Abstract: Phthalonitrile adhesive formulations are provided. Such an adhesive formulation may comprise an etherimide-phthalonitrile oligomer having formula wherein R1 is an unsubstituted or substituted aryl group or an unsubstituted or substituted cycloalkyl group; R2 is an unsubstituted or substituted aryl group and n has a value of from 1 to 30. Also provided are methods of making and using the adhesive formulations.

Abstract: Disclosed herein are methods and apparatuses for curing a polymerizable material capable of cure through a redox reaction by electrically contacting the polymerizable material with an anode and a cathode to create a voltage bias that promotes curing of the polymerizable material.

Abstract: A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component.

Abstract: An adhesion promoter composition is disclosed. The adhesion promoter composition includes a first reactive silane compound and a second reactive silane compound, where the second reactive silane is different from the first. The adhesion promoter composition also includes one or more organic solvents and an organic base. A method for applying the adhesion promoter composition is also disclosed.

Abstract: An adhesion promoter composition is disclosed. The adhesion promoter composition also includes one or more reactive silanes which includes a mercaptopropyltrimethoxysilane, a glycidoxypropyltrimethoxysilane, or combinations thereof. The adhesion promoter composition also includes one or more reactive organometallics. The composition may include one or more organic solvents, an optional one or more gelling agents, and an optional one or more functional additives.