Patents by Inventor Ashok K. Das

Ashok K. Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aluminum deposition shield
    Patent number: 6589407
    Abstract: An aluminum deposition shield substantially improves transfer of radiated heat from within the vacuum chamber, in comparison to a stainless steel deposition shield. The aluminum deposition shield remains cooler during wafer processing and assists in cooling the chamber components.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: July 8, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Anantha Subramani, Ashok K. Das, Leif E. DeLaurentis, Michael Rosenstein
  • Nozzle for introduction of reactive species in remote plasma cleaning applications
    Publication number: 20020179247
    Abstract: A nozzle for a plasma reactor of the type having a processing chamber, with the nozzle comprising a body having interior and exterior sides and a first end. The interior side defines a throughway having a longitudinal axis, and the first end includes an opening in fluid communication with the throughway. The body extends from the first end, terminating in a second end, and includes an aperture formed proximate to the second end. The aperture is configured to create, from a flow of fluid propagating through the throughway and exiting said aperture, a sheet of the fluid moving tangentially to a flow cell established in the processing chamber.
    Type: Application
    Filed: June 4, 2001
    Publication date: December 5, 2002
    Inventors: Matthew F. Davis, Huutri Dao, Ashok K. Das
  • CONNECTORS FOR AN ELETROSTATIC CHUCK
    Publication number: 20020022403
    Abstract: Apparatus for connecting a first component to a second component in that the first component has a first connecting member attached thereto, the second component has a second connecting member attached thereto and either of the first or second connecting members is provided with a relief. The apparatus is a connector, the first component is a power supply and the second component is an electrostatic chuck. The first connecting member has a bore provided on a top end. The second connecting member has a threaded opening for receiving the first connecting member. Alternately, the second connecting member is provided with a groove disposed radially outward of the threaded opening. The connecting members provided with the reliefs accommodate and withstand the forces exerted thereupon caused by thermal expansion during semiconductor wafer processing.
    Type: Application
    Filed: August 6, 1999
    Publication date: February 21, 2002
    Inventors: WING L. CHENG, DENNIS S. GRIMARD, SENH THACH, CHENG-HSIUNG TSAI, ASHOK K. DAS, VIJAY D. PARKHE
  • High pressure/high temperature process chamber
    Patent number: 5990453
    Abstract: An improved processing chamber is provided that withstands numerous high pressure/high temperature processing cycles without heater breakage. The processing chamber contains a high conductivity, a high emissivity and/or a high transmissivity shield positioned in sufficient proximity to a heater to prohibit gas currents such as convection current loops from forming between the shield and the heater. The shield is preferably a thin anodized metal or a sapphire sheet.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: November 23, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Ashok K. Das, Joe Stevens, Erich Tzou, Matt Tsai