Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.

Abstract: The present invention relates to copper-iron-nickel alloys having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Alloys in accordance with the present invention consist essentially of from 10% to about 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred alloys have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1. The process includes casting the alloy and treating the iron-nickel phase of alloy to minimize its surface volume. The treating step may comprise speroidizing the iron-nickel phase or applying an electromagnetic stirring force to the alloy during the casting step.

Abstract: A molten metal gas-atomizing spray-depositing apparatus has an atomizer for atomizing a stream of molten metal into metal particles in a divergent spray pattern thereof being of higher temperature at a center region of the pattern than at an outer peripheral region thereof. A substrate is continuously movable along an endless path and has an area thereon disposed below the atomizer for receiving a deposit of the particles in the spray pattern to form a product on the substrate being substantially uniform in thickness. The deposit-receiving substrate area has consecutively arranged upstream, intermediate and downstream portions upon which respective inner, intermediate and outer cross-sectional portions of the metal deposit are layered one upon the next to form the product.

Abstract: A molten metal gas-atomizing spray-depositing apparatus has an atomizer which employs a pressurized gas flow for atomizing a stream of molten metal into a spray pattern of metal particles and for producing a flow of the particles in the pattern thereof along with the pressurized gas flow in a generally downward direction. The apparatus also has a substrate, such as composed of stainless steel, disposed in spaced relation below the atomizer with at least an upper surface layer of a glass thereon, being thermally softenable over a broad predetermined temperature range. The pressurized gas flow impinges on the glass surface layer of the substrate which receives a deposit of the particles in the spray pattern to form a product thereon.

Abstract: A molten metal gas-atomizing spray-depositing apparatus has an atomizer employing a pressurized gas flow for atomizing a stream of molten metal into a divergent spray pattern of metal particles and producing a flow of the particles in the pattern thereof along with the gas flow in a generally downward direction. The apparatus also includes a substrate movable continuously along an endless path and having an area thereon disposed below the atomizer for receiving a deposit of the particles in the spray pattern to form a product on the substrate being substantially uniform in thickness. The endless path of the substrate is generally elongated in the downward direction and thus extends parallel to the general downward direction of gas flow such that any particle overspray past the deposit-receiving area is carried by the gas flow downward past the substrate, substantially avoiding entrainment of the particle overspray in the product being formed on the substrate.

Abstract: A molten metal gas-atomizing spray-depositing apparatus has an atomizer which employs a pressurized gas flow for atomizing a stream of molten metal into a spray pattern of semi-solid metal particles. The apparatus also has a movable non-preheated substrate composed of a material having a predetermined thermal conductivity of about one or less (W/M-K) being disposed below the atomizeer. The substrate receives thereon a deposit of the particles in the spray pattern. The pressurized gas flow also impinges thereon for cooling the deposit on the substrate to form a product thereon. The predetermined thermal conductivity of the substrate of one or less precludes extraction of heat by the substrate from, and thus solidification of, the deposit upon initial contact with the substrate whereby a reduction of porosity is achieved in the deposit.