Patents by Inventor Ashok Srikantappa

Ashok Srikantappa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5962926
    Abstract: The present invention comprises a semiconductor device (20) having a active circuit (22) and a bond pad area (24). Within the bond pad area there are a plurality of rows of bond pads. Sets of bond pads (30-36) include one bond pad from each row. The bond pads (26) are uniquely positioned within the bond pad area (24) to allow for a first wire pitch between pads which are adjacent and in the same set, and a second wire pitch between pads which are adjacent and in different sets. A method of determining placement of the bond pads (26) is taught.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: October 5, 1999
    Assignee: Motorola, Inc.
    Inventors: Victor Manuel Torres, Ashok Srikantappa, Laxminarayan Sharma
  • Patent number: 5898213
    Abstract: A bond post configuration for wire bonded semiconductors has bond posts grouped in three posts where two are arranged closely to a side of a die about a first axis and a third is arranged in between and further removed from the side about a second axis. In one form, the bond post configuration is a radial configuration. Additionally, conductive traces which extend from the bond posts and away from the die are placed off-center from the the bond posts about the first axis to provide more placement area for the bond posts arranged about the second axis. The bond post configuration may be utilized in any wire bonded semiconductor.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: April 27, 1999
    Assignee: Motorola, Inc.
    Inventors: Victor Manuel Torres, Laxminarayan Sharma, Ashok Srikantappa