Abstract: An antenna array with a layered structure having a base layer with a metamaterial structure, a printed circuit board (PCB) layers, a feed layer arranged on the opposite side of the PCB from the RF IC(s), and a radiating layer arranged on the feed layer. The radiating layer having a plurality of radiating elements. The metamaterial structure is arranged to attenuate electromagnetic radiation propagating between the at least two adjacent waveguides in the frequency band.

Abstract: An antenna array with a layered structure comprising a base layer with a metamaterial structure; a printed circuit board (PCB) layer; a feed layer arranged on the opposite side of the PCB from the RF IC(s); and a radiating layer arranged on the feed layer comprising a plurality of radiating elements, wherein the metamaterial structure is arranged to attenuate electromagnetic radiation propagating between the at least two adjacent waveguides in the frequency band.

Abstract: A measurement device (100) for measuring antenna characteristics of an antenna under test (150, AUT), the AUT having a radiating element (160), the measurement device (100) comprising an exterior surface (110), where a measurement aperture (120) is formed in the exterior surface, and a repetitive structure (130) is arranged on the exterior surface, the repetitive structure (130) comprising a plurality of protruding conductive elements (135) arranged to surround the measurement aperture (120) and to define a passage (140) into the measurement aperture (120), the repetitive structure (130) being configured to attenuate electromagnetic signal propagation in a frequency band past the repetitive structure (130) while allowing propagation via the passage (140).

Abstract: A phased array is disclosed, including: a base layer including a substrate with a plurality of protruding posts, for stopping wave propagation along the base layer, and a printed circuit board (PCB) arranged on the base layer, and including at least one phased array radio frequency (RF) integrated circuit (IC) on a first side of the PCB facing the base layer and the protruding posts. The PCB further includes feeds for transferring of RF signals from the phased array RF IC(s) to an opposite second side of the PCB. A radiating layer, including a plurality of radiating elements for transmitting and/or receiving RF signals from the phased array antenna is also provided, together with a feeding layer for transfer of RF signals, arranged between the feeds of the PCB on the second side and the radiating elements of the radiating layer.

Abstract: A packaging structure (100) having a split-block assembly with a first and a second conducting block section (10A,20A) and at least one transition between a first planar transmission line (2A) and a second transmission line (11A), and one or more input/output ports. The first transmission line (2A) is arranged on a substrate disposed on the first conducting block section (10A) and has a coupling section (3A), a cavity (4A) with a cavity opening in an upper surface of the first conducting block section (10A), and the second transmission line (11A) being in line with the first transmission line (2A) and located on an opposite side of the opening of the cavity (4A).

Abstract: A phased array is disclosed, including: a base layer including a substrate with a plurality of protruding posts, for stopping wave propagation along the base layer, and a printed circuit board (PCB) arranged on the base layer, and including at least one phased array radio frequency (RF) integrated circuit (IC) on a first side of the PCB facing the base layer and the protruding posts. The PCB further includes feeds for transferring of RF signals from the phased array RF IC(s) to an opposite second side of the PCB. A radiating layer, including a plurality of radiating elements for transmitting and/or receiving RF signals from the phased array antenna is also provided, together with a feeding layer for transfer of RF signals, arranged between the feeds of the PCB on the second side and the radiating elements of the radiating layer.

Abstract: The present invention relates to a packaging structure (100) comprising a split-block assembly with a first and a second conducting block section (10A,20A) and at least one transition between a first planar transmission line (2A) and a second transmission line (11A), and one or more input/output ports. The first transmission line (2A) is arranged on a substrate, e.g. an MMIC (1A), disposed on the first conducting block section (10A) and comprises a coupling section (3A), the first conducting block (10A) comprises a cavity (4A) with a cavity opening in an upper surface of the first conducting block section (10A) so arranged that, in an assembled state of the split-block assembly, the coupling section (3A) will be located above, or in, the opening of the cavity (4A), the second transmission line (11A) being in line with the first transmission line (2A) and located on an opposite side of the opening of the cavity (4A).

Abstract: The present invention relates to a transition arrangement (100) comprising a transition between a substrate integrated waveguide, SIW, (20) of a circuit arrangement and a waveguide and/or antenna structure (10). It comprises a first conducting plate (1) and a second conducting plate (2). The SIW (20) is arranged on said first conducting plate, and an impedance matching structure (4) is connected to the second conducting plate.

Abstract: The present invention relates to a transition arrangement (100) comprising a transition between a substrate integrated waveguide, SIW, (20) of a circuit arrangement and a waveguide and/or antenna structure (10). It comprises a first conducting plate (1) and a second conducting plate (2). The SIW (20) is arranged on said first conducting plate, and an impedance matching structure (4) is connected to the second conducting plate.