Patents by Inventor Ashur Bet-Shliemoun

Ashur Bet-Shliemoun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip packages
    Patent number: 9425114
    Abstract: A flip chip package includes a substrate, a silicon die supported on and electrically connected with the substrate, and a lid attached with the substrate and covering the silicon die. The silicon die has a die surface including a first set of tracks formed therein, and the lid may have a lid surface including a second set of tracks formed therein. A thermal interface material may be disposed between the die surface and lid surface and at least partially fill the first and second sets of tracks.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: August 23, 2016
    Assignee: Oracle International Corporation
    Inventor: Ashur Bet-Shliemoun
  • FLIP CHIP PACKAGES
    Publication number: 20150279761
    Abstract: A flip chip package includes a substrate, a silicon die supported on and electrically connected with the substrate, and a lid attached with the substrate and covering the silicon die. The silicon die has a die surface including a first set of tracks formed therein, and the lid may have a lid surface including a second set of tracks formed therein. A thermal interface material may be disposed between the die surface and lid surface and at least partially fill the first and second sets of tracks.
    Type: Application
    Filed: March 27, 2015
    Publication date: October 1, 2015
    Inventor: Ashur Bet-Shliemoun