Patents by Inventor Ashutosh Baheti
Ashutosh Baheti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11965976Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.Type: GrantFiled: June 17, 2020Date of Patent: April 23, 2024Assignee: Infineon Technologies AGInventors: Saverio Trotta, Reinhard-Wolfgang Jungmaier, Dennis Noppeney, Ashutosh Baheti, Ismail Nasr, Jagjit Singh Bal
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Publication number: 20240097313Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.Type: ApplicationFiled: November 27, 2023Publication date: March 21, 2024Inventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
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Patent number: 11916007Abstract: A semiconductor device includes a substrate comprising an antenna and a conductive feature; an integrated circuit (IC) die attached to the substrate and comprising a radio frequency (RF) circuit; and a flexible circuit integrated with the substrate, where the flexible circuit is electrically coupled to the IC die and the substrate, a first portion of the flexible circuit being disposed between opposing sidewalls of the substrate, a second portion of the flexible circuit extending beyond the opposing sidewalls of the substrate, the second portion of the flexible circuit comprising an electrical connector at a distal end.Type: GrantFiled: October 23, 2019Date of Patent: February 27, 2024Assignee: INFINEON TECHNOLOGIES AGInventors: Ashutosh Baheti, Eung San Cho, Saverio Trotta
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Publication number: 20240047855Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.Type: ApplicationFiled: October 12, 2023Publication date: February 8, 2024Inventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
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Patent number: 11870130Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.Type: GrantFiled: July 27, 2020Date of Patent: January 9, 2024Assignee: Infineon Technologies AGInventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
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Publication number: 20230393275Abstract: A wireless multimode system includes: an array of N antenna elements that includes a first portion of M antenna elements and a second portion of L antenna elements; M transmission amplifiers configured to transmit, via the M antenna elements, frames of transmit data, where the frames of transmit data include transmit radar signals and transmit communication signals; M reception amplifiers configured to receive, via the M antenna elements, frames of receive data, where the frames of receive data includes receive communication signals; and L reception amplifiers configured to receive, via the L antenna elements, receive radar signals; and a resource scheduler configured to allocate bandwidth for transmit radar signals and transmit communication signals within the frames of transmit data based on one or more predetermined parameters.Type: ApplicationFiled: August 23, 2023Publication date: December 7, 2023Inventors: Ivan Tsvelykh, Ashutosh Baheti, Avik Santra, Samo Vehovc
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Patent number: 11828835Abstract: A radio frequency (RF) device includes a display screen and a flexible substrate. The display screen is configured to transmit visible light at a first side of the display screen. The flexible substrate includes a first portion overlapping the first side, and a second portion overlapping an opposite second side of the display screen. The RF device further includes a plurality of antennas disposed over the first portion of the flexible substrate and the first side, and a transmission line disposed on a bent region of the flexible substrate between the first and second portions. The plurality of antennas is configured to transmit/receive RF signals on the first side of the display screen. The display screen is opaque to the RF signals. The transmission line is configured to propagate the RF signals between the first portion and the second portion on the opposite second side of the display screen.Type: GrantFiled: August 12, 2020Date of Patent: November 28, 2023Assignee: INFINEON TECHNOLOGIES AGInventors: Ashutosh Baheti, Saverio Trotta
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Patent number: 11817617Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.Type: GrantFiled: August 19, 2020Date of Patent: November 14, 2023Assignee: Infineon Technologies AGInventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
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Patent number: 11791538Abstract: In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate.Type: GrantFiled: March 25, 2022Date of Patent: October 17, 2023Assignee: Infineon Technologies AGInventors: Ashutosh Baheti, Saverio Trotta
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Patent number: 11774592Abstract: A wireless multimode system includes: an array of N antenna elements that includes a first portion of M antenna elements and a second portion of L antenna elements; M transmission amplifiers configured to transmit, via the M antenna elements, frames of transmit data, where the frames of transmit data include transmit radar signals and transmit communication signals; M reception amplifiers configured to receive, via the M antenna elements, frames of receive data, where the frames of receive data includes receive communication signals; and L reception amplifiers configured to receive, via the L antenna elements, receive radar signals; and a resource scheduler configured to allocate bandwidth for transmit radar signals and transmit communication signals within the frames of transmit data based on one or more predetermined parameters.Type: GrantFiled: September 18, 2019Date of Patent: October 3, 2023Assignee: Infineon Technologies AGInventors: Ivan Tsvelykh, Ashutosh Baheti, Avik Santra, Samo Vehovc
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Publication number: 20230307818Abstract: In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate.Type: ApplicationFiled: March 25, 2022Publication date: September 28, 2023Inventors: Ashutosh Baheti, Saverio Trotta
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Patent number: 11733347Abstract: A method of forming a radar system includes forming a first receive antenna and a first ground plane region by patterning a first conductive layer on a first surface of a first laminate layer of a radar package, forming a transmit antenna and a second ground plane region by patterning a second conductive layer on a second surface of the first laminate layer, forming a second laminate layer of the radar package over the second conductive layer, forming a third conductive layer over the second laminate layer, forming a second receive antenna by patterning the third conductive layer, and attaching a radio frequency integrated circuit chip to the radar package. The radio frequency integrated circuit chip is coupled to the transmit antenna, the first receive antenna, and the second receive antenna. The second surface is opposite the first surface.Type: GrantFiled: February 12, 2021Date of Patent: August 22, 2023Assignee: INFINEON TECHNOLOGIES AGInventors: Saverio Trotta, Reinhard-Wolfgang Jungmaier, Adrian Mikolajczak, Ashutosh Baheti
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Publication number: 20230252818Abstract: In an embodiment, a method for authenticating a user of a car includes: transmitting a plurality of radiation pulses through a predetermined portion of a surface of the car towards a portion of a hand of the user using a millimeter-wave radar, receiving a reflected signal from the portion of the hand using the millimeter-wave radar; generating a fingerprint signature based on the reflected signal; comparing the fingerprint signature to a database of authorized fingerprint signatures; and authorizing the user based on whether the fingerprint signature matches an authorized fingerprint signature of the database of authorized fingerprint signatures.Type: ApplicationFiled: April 21, 2023Publication date: August 10, 2023Inventors: Neha Baheti, Ashutosh Baheti, Avik Santra
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Patent number: 11670110Abstract: In an embodiment, a method for authenticating a user of a car includes: transmitting a plurality of radiation pulses through a predetermined portion of a surface of the car towards a portion of a hand of the user using a millimeter-wave radar; receiving a reflected signal from the portion of the hand using the millimeter-wave radar; generating a fingerprint signature based on the reflected signal; comparing the fingerprint signature to a database of authorized fingerprint signatures; and authorizing the user based on whether the fingerprint signature matches an authorized fingerprint signature of the database of authorized fingerprint signatures.Type: GrantFiled: June 24, 2021Date of Patent: June 6, 2023Assignee: INFINEON TECHNOLOGIES AGInventors: Neha Baheti, Ashutosh Baheti, Avik Santra
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Patent number: 11656333Abstract: In accordance with an embodiment, a method of recognizing a biological target includes performing radar measurements for a plurality of sites on the biological target using a millimeter-wave radar sensor, producing a target data set for the plurality of sites based on the radar measurements, extracting features from the target data set, comparing the extracted features to stored features, and determining whether the extracted features match the stored features based on the comparing.Type: GrantFiled: January 23, 2020Date of Patent: May 23, 2023Assignee: Infineon Technologies AGInventors: Saverio Trotta, Ashutosh Baheti, Reinhard-Wolfgang Jungmaier, Avik Santra
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Patent number: 11640208Abstract: A method for operating a distributed neural network having a plurality of intelligent devices and a server includes: generating, by a first intelligent device of the plurality of intelligent devices, a first output using a first neural network model running on the first intelligent device and using a first input vector to the first neural network model; outputting, by the first intelligent device, the first output; receiving, by the first intelligent device, a gesture feedback on the first output from a user; determining, by the first intelligent device, a user rating of the first output from the gesture feedback; labeling, by the first intelligent device, the first input vector with a first label in accordance with the user rating; and training, by the first intelligent device, the first neural network model using the first input vector and the first label.Type: GrantFiled: November 21, 2019Date of Patent: May 2, 2023Assignee: Infineon Technologies AGInventors: Souvik Hazra, Ashutosh Baheti, Avik Santra
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Publication number: 20230075303Abstract: A method for testing a radar device including a master radar device and a slave radar device includes: moving a test target through a field of view of the radar device; measuring an angle of the test target with respect to the radar device at a plurality of positions; evaluating the reliability of the measured angles; and specifying at least one of a usable field of view of the radar device or a number of required repetitions for a reliable measurement based on the evaluating.Type: ApplicationFiled: September 6, 2022Publication date: March 9, 2023Inventors: Raghavendran Vagarappan Ulaganathan, Ashutosh Baheti, Reinhard-Wolfgang Jungmaier, Saverio Trotta
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Patent number: 11600902Abstract: A semiconductor device includes: a dielectric substrate; an integrated circuit (IC) die disposed inside an opening of the dielectric substrate, where the IC die is configured to transmit or receive radio frequency (RF) signals; a dielectric material in the opening of the dielectric substrate and around the IC die; a redistribution structure along a first side of the dielectric substrate, where a first conductive feature of the redistribution structure is electrically coupled to the IC die; a second conductive feature along a second side of the dielectric substrate opposing the first side; a via extending through the dielectric substrate, where the via electrically couples the first conductive feature and the second conductive feature; and an antenna at the second side of the dielectric substrate, where the second conductive feature is electrically or electromagnetically coupled to the antenna.Type: GrantFiled: February 13, 2020Date of Patent: March 7, 2023Assignee: Infineon Technologies AGInventors: Ashutosh Baheti, EungSan Cho, Saverio Trotta
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Patent number: 11592479Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.Type: GrantFiled: July 16, 2021Date of Patent: February 28, 2023Assignee: Infineon Technologies AGInventors: Saverio Trotta, Ashutosh Baheti, Reinhard-Wolfgang Jungmaier, Dennis Noppeney
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Patent number: 11550046Abstract: In accordance with an embodiment, an apparatus includes a millimeter wave radar sensor system configured to detect a location of a body of a person, where the detected location of the body of the person defines a direction of the person relative to the apparatus; and a microphone system configured to generate at least one audio beam as a function at least of the direction.Type: GrantFiled: February 25, 2019Date of Patent: January 10, 2023Assignee: Infineon Technologies AGInventors: Reinhard-Wolfgang Jungmaier, Ashutosh Baheti, Jagjit Singh Bal, Thomas Gmeinder, Henk Muller, Shyam Nallabolu, Dennis Noppeney, Avik Santra, Raghavendran Vagarappan Ulaganathan