Abstract: In an embodiment, a method of tracking includes predicting a predicted state, in a global coordinate space, of an object based on a state of the object; determining in local coordinates the predicted state; determining a plurality of measurements of the object, in the local coordinates, with first and/or second radar sensors; determining a matching of the predicted state and the plurality of measurements, in the local coordinates, for a matching result; and updating the state of the object based on the matching result. The first and second sensors are arranged along perpendicular lines which intersect at the origin of the global coordinate space.

Abstract: An earphone device includes a housing comprising a top region and a bottom region, an acoustic transducer disposed in the bottom region of the housing, and a radar system disposed in the top region of the housing. The radar system includes a first side and an opposite second side. The radar system is configured to detect a first object located on the first side of the radar system, and detect biometric data from a second object located on the second side of the radar system.

Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.

Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.

Abstract: A wireless multimode system includes: an array of N antenna elements that includes a first portion of M antenna elements and a second portion of L antenna elements; M transmission amplifiers configured to transmit, via the M antenna elements, frames of transmit data, where the frames of transmit data include transmit radar signals and transmit communication signals; M reception amplifiers configured to receive, via the M antenna elements, frames of receive data, where the frames of receive data includes receive communication signals; and L reception amplifiers configured to receive, via the L antenna elements, receive radar signals; and a resource scheduler configured to allocate bandwidth for transmit radar signals and transmit communication signals within the frames of transmit data based on one or more predetermined parameters.

Abstract: An electronic device includes a housing, an electrically conductive layer and millimeter-wave (mmw) circuitry configured to emit a mmw signal. The mmw circuitry is arranged in the housing and on a first side of the electrically conductive layer. The housing comprises at least one portion configured as a dielectric lens to refract the mmw signal at least partially outside the housing towards a second side opposite to the first side of the electrically conductive layer.

Abstract: A system includes a millimeter-wave radar sensor disposed on a circuit board, a plurality of antennas coupled to the millimeter-wave radar sensor and disposed on the circuit board, and a processing circuit coupled to the millimeter-wave radar sensor and disposed on the circuit board. The processing circuit is configured to determine vital signal information based on output from the millimeter-wave radar sensor.

Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.

Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.

Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

Abstract: A semiconductor device includes a substrate comprising an antenna and a conductive feature; an integrated circuit (IC) die attached to the substrate and comprising a radio frequency (RF) circuit; and a flexible circuit integrated with the substrate, where the flexible circuit is electrically coupled to the IC die and the substrate, a first portion of the flexible circuit being disposed between opposing sidewalls of the substrate, a second portion of the flexible circuit extending beyond the opposing sidewalls of the substrate, the second portion of the flexible circuit comprising an electrical connector at a distal end.

Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.

Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

Abstract: A wireless multimode system includes: an array of N antenna elements that includes a first portion of M antenna elements and a second portion of L antenna elements; M transmission amplifiers configured to transmit, via the M antenna elements, frames of transmit data, where the frames of transmit data include transmit radar signals and transmit communication signals; M reception amplifiers configured to receive, via the M antenna elements, frames of receive data, where the frames of receive data includes receive communication signals; and L reception amplifiers configured to receive, via the L antenna elements, receive radar signals; and a resource scheduler configured to allocate bandwidth for transmit radar signals and transmit communication signals within the frames of transmit data based on one or more predetermined parameters.

Abstract: A radio frequency (RF) device includes a display screen and a flexible substrate. The display screen is configured to transmit visible light at a first side of the display screen. The flexible substrate includes a first portion overlapping the first side, and a second portion overlapping an opposite second side of the display screen. The RF device further includes a plurality of antennas disposed over the first portion of the flexible substrate and the first side, and a transmission line disposed on a bent region of the flexible substrate between the first and second portions. The plurality of antennas is configured to transmit/receive RF signals on the first side of the display screen. The display screen is opaque to the RF signals. The transmission line is configured to propagate the RF signals between the first portion and the second portion on the opposite second side of the display screen.

Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.

Abstract: In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate.

Abstract: A wireless multimode system includes: an array of N antenna elements that includes a first portion of M antenna elements and a second portion of L antenna elements; M transmission amplifiers configured to transmit, via the M antenna elements, frames of transmit data, where the frames of transmit data include transmit radar signals and transmit communication signals; M reception amplifiers configured to receive, via the M antenna elements, frames of receive data, where the frames of receive data includes receive communication signals; and L reception amplifiers configured to receive, via the L antenna elements, receive radar signals; and a resource scheduler configured to allocate bandwidth for transmit radar signals and transmit communication signals within the frames of transmit data based on one or more predetermined parameters.

Abstract: In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate.