Abstract: Data throughput functionality is improved in a network which supports high data rate applications and additional applications within a single receiver. Guidelines for tuning the receiver at variable time periods to avoid timeouts and fill radio link holes which result from non-received/unrecognized data are provided in connection with an algorithm of operation.

Abstract: A heat management apparatus for disposition in a medical imaging system is disclosed. The apparatus includes a thermally conductive detector module, sensor components disposed upon the detector module, and signal processing electronics in thermal communication with the detector module, the signal processing electronics disposed proximate the sensor components. A main heat conductor is in thermal communication with a first defined portion of a length of the detector module, and a local heat conductor is in thermal communication with a second defined portion of the length of the detector module.

Abstract: An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

Abstract: A method includes thermally stabilizing a Computed Tomography (CT) detector module.

Abstract: A method includes controlling a PET detector temperature at a constant temperature.

Abstract: A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a variety of insulative, radiative, conductive, and convective heat distribution techniques. For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

Abstract: The invention provides a purchase sequence browser (PuSB), i.e. a graphical user interface (GUI) that facilitates insight discovery and exploration of product affinities across time, generated by a purchase sequence analysis of a retailer's transaction data. A purchase sequence browser allows the user to browse the most significant product phrases discovered by an exhaustive search of the product affinities across time; explore the retail grammar to create both forward and backward phrase trees or alternate purchase paths starting from, or ending in, a product; generate consistent purchase sequences given some constraints on the products and their order; and profile the value of a product across time with regard to other products fixed in time.

Abstract: A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

Abstract: Disclosed herein is a method for assembly of Computed Tomography (CT) Detector electronic circuits. A thermally conductive adhesive is dispensed on a first side of a first circuit board, the first circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the first circuit board. The thermally conductive adhesive is also dispensed on a first side of a second circuit board, the second circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the second circuit board. A first heat sink is mounted to the first side of the first circuit board. A second heat sink mounted to the first side of the second circuit board. The adhesive is cured on the first and the second circuit boards. The first circuit board is attached to the second circuit board, wherein the second side of the first circuit board is adjacent to the second side of the second circuit board.

Abstract: A product space browser (PSB), which comprises a graphical user interface (GUI) that facilitates insight discovery through exploration and analysis of product space graphs generated by applying a product affinity engine to retailer's transaction data in a market basket context, is disclosed.

Abstract: Disclosed herein is a method for assembly of Computed Tomography (CT) Detector electronic circuits. A thermally conductive adhesive is dispensed on a first side of a first circuit board, the first circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the first circuit board. The thermally conductive adhesive is also dispensed on a first side of a second circuit board, the second circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the second circuit board. A first heat sink is mounted to the first side of the first circuit board. A second heat sink mounted to the first side of the second circuit board. The adhesive is cured on the first and the second circuit boards. The first circuit board is attached to the second circuit board, wherein the second side of the first circuit board is adjacent to the second side of the second circuit board.

Abstract: A method and system for variable speed fan control for thermal management of a device includes disposing a first temperature sensor proximate a variable speed fan to measure an air temperature of inlet air Tair that cools the device by convection air flow. A controller is configured to compensate for changes in Tair by varying a convection coefficient (h) which is a strong function of air velocity to maintain the product of h*?T at a constant value, wherein ?T is a temperature differential between the device (TAD) minus Tair. Thus, h is varied by varying air velocity by varying a speed of the variable speed fan.

Abstract: This invention provides a process for enhancing the generation of hydroxyl radicals in aqueous mixtures containing hydrogen peroxide, which process comprises supplying oxygen and magnesium oxide to the mixture and irradiating it with UV light. The process can be used, for example, for processing ballast water, industrial waste waters, and municipal waste waters.

Abstract: The present invention discloses a method and apparatus for cooling the electronics associated with Computed Tomography (CT) detector arrays. More particularly, the present invention discloses use of thermoelectric coolers in cooling CT detector electronics. The present invention also provides for using blowers or fans to recirculated air within a plenum for the cooling of CT detector electronics. The present invention also discloses the use of wick type heat pipes being placed either horizontally or with the evaporator end radially farther out than the condenser end such that rotational forces assist with heat flow through the heat pipe for cooling CT detector electronics. The present invention also discloses use of axial groove heat pipes to cool the CT detector electronics because they have enhanced performance under revolving conditions. Lastly, the present invention discloses use of heat sinks and circulation fans in combination with either type of heat pipe.

Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board.

Abstract: A method and system for variable speed fan control for thermal management of a device includes disposing a first temperature sensor proximate a variable speed fan to measure an air temperature of inlet air Tair that cools the device by convection air flow. A controller is configured to compensate for changes in Tair by varying a convection coefficient (h) which is a strong function of air velocity to maintain the product of h*?T at a constant value, wherein ?T is a temperature differential between the device (TAD) minus Tair. Thus, h is varied by varying air velocity by varying a speed of the variable speed fan.

Abstract: Data throughput functionality is improved in a network which supports high data rate applications and additional applications within a single receiver. Guidelines for tuning the receiver at variable time periods to avoid timeouts and fill radio link holes which result from non-received/unrecognized data are provided in connection with an algorithm of operation.

Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly.

Abstract: The present invention discloses a method and apparatus for cooling the electronics associated with Computed Tomography (CT) detector arrays. More particularly, the present invention discloses use of thermoelectric coolers in cooling CT detector electronics. The present invention also provides for using blowers or fans to recirculated air within a plenum for the cooling of CT detector electronics. The present invention also discloses the use of wick type heat pipes being placed either horizontally or with the evaporator end radially farther out than the condenser end such that rotational forces assist with heat flow through the heat pipe for cooling CT detector electronics. The present invention also discloses use of axial groove heat pipes to cool the CT detector electronics because they have enhanced performance under revolving conditions. Lastly, the present invention discloses use of heat sinks and circulation fans in combination with either type of heat pipe.

Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly.