Abstract: An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like.

Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

Abstract: Systems and methods for improved window mounting on electronic devices are provided. A window mounting assembly can include a heat activated adhesive, such as a heat activated film (“HAF”), which can be used to secure a window to an enclosure. In some embodiments, heated air can be blown in from a bottom side of the window, which can provide better offset control in the assembly. In some embodiments, an undercut can be made in the enclosure that can act as a trap for HAF overflow. An overhang that is created by the undercut can reduce the visibility of HAF overflow from a user. In addition, the heated air that is applied to the window can create a high pressure region in an area underneath the window. The high pressure region can direct the HAF overflow away from this area and towards the undercut in the enclosure.

Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

Abstract: Electronic devices may include light sensors. The light sensors may include alignment features. The light sensors may be optically aligned with an aperture in an opaque structure. The opaque structure may be formed from an opaque material or a transparent material with an opaque coating. The light sensor may be mounted in a support structure that has been optically aligned with the aperture. The light sensor or the support structure may include extended portions that are transparent to ultraviolet light. Ultraviolet light may be transmitted through the extended portions to cure adhesive that attaches the light sensor or the support structure to the opaque structure. The light sensor may be optically aligned with the aperture by viewing the aperture through an opening in the support structure, by viewing the alignment features on the light sensor through the aperture or by gathering alignment data using the light sensor during alignment operations.

Abstract: An electronic device may include a camera module. Control circuitry within the electronic device may use an image sensor within the camera module to acquire digital images. The camera module may have lens structures that are supported by lens support structures such as a lens barrel and lens carrier. An actuator such as a voice coil motor may control the position of the lens support structures relative to internal support structures such as upper and lower spacer members. Springs may be used to couple the lens support structures to the internal support structures. Outer wall structures in the camera module such as a ferromagnetic shield structures may surround and enclose at least some of the internal support structures. The outer wall structures may have openings. The internal support structures may have pins or other alignment structures that protrude through the openings.

Abstract: A vibrator designed to be integrated into a portable electronic device as part of a haptic alert device has a linear electric motor that is coupled to actively drive a moveable weight in back-and-forth directions to produce the desired vibration. A lock mechanism has a restraining member that is biased into a lock position, which prevents the moveable weight from moving in the back-and-forth directions when the vibrator is inactive. Other embodiments are also described and claimed.

Abstract: Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.

Abstract: This application relates generally to battery removal apparatuses. For example, one battery removal apparatus disclosed herein comprises a pull tab configured to be disposed between a battery and a casing of a portable computing device. The pull tab is shaped such that at least one area of the battery and the casing are exposed to one another when the battery, the pull tab and the casing are compressed together. An adhesive layer is shaped to cover the at least one exposed area such that the battery adheres to the casing, and the pull tab is reinforced so as to prevent the pull tab from tearing when used to remove the battery from the portable computing device. Other battery removal apparatuses include a pull string battery removal apparatus as well as a battery removal apparatus that incorporates both a pull tab and one or more pull strings.

Abstract: An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of the electronic device. The ejectable component assembly may also be provided with an ejector mechanism for at least partially ejecting the removable module from the connector. The ejector mechanism may receive a user input force at an ejector user interface, translate that user input force into an ejection force, and apply that ejection force onto the removable module for ejecting the module. The ejector user interface may be provided at any suitable position of the housing that may not interfere with other functions of the device. The path along which the ejector mechanism translates the user input force into the ejection force between the ejector user interface and the removable module may be provided in any suitable way throughout the device.

Abstract: A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.

Abstract: An electronic device may be provided with shape memory structures. The shape memory structures may be used to form actuators for a camera shutter, an actuator for moving an optical filter, or other actuators in an electronic device. A camera shutter may have an opaque shutter member that is movable between a first position in which the shutter is closed and blocks light from a digital image sensor and a second position in which the shutter is open and allows light to reach the digital image sensor. The camera shutter may have an associated color filter structure. Shape memory wire may be configured to form a loop that heats upon application of a signal or may be configured to form a twisting or linear actuator. The camera shutter may be provided with a controllable aperture.

Abstract: A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). In one embodiment, a molded acoustic chamber can be formed to assist in directing audio sound between an opening an outer housing and an internal flexible electronic substrate. The audio element can be mounted on or coupled to the flexible electrical substrate over an opening therein that allows allow audio sound to pass there through. The molded acoustic chamber can also be formed such that it includes a barrier, such as a mesh barrier, so that undesired foreign substances can be blocked from entry or further entry into the audio chamber. The molded acoustic chamber can also be formed such that it includes one or more acoustic seals that can be used to provide an acoustic seal between the molded acoustic chamber and the opening in the outer housing.

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure.

Abstract: Systems and methods for improved window mounting on electronic devices are provided. A window mounting assembly can include a heat activated adhesive, such as a heat activated film (“HAF”), which can be used to secure a window to an enclosure. In some embodiments, heated air can be blown in from a bottom side of the window, which can provide better offset control in the assembly. In some embodiments, an undercut can be made in the enclosure that can act as a trap for HAF overflow. An overhang that is created by the undercut can reduce the visibility of HAF overflow from a user. In addition, the heated air that is applied to the window can create a high pressure region in an area underneath the window. The high pressure region can direct the HAF overflow away from this area and towards the undercut in the enclosure.

Abstract: Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.

Abstract: Electronic devices may include light sensors. The light sensors may include alignment features. The light sensors may be optically aligned with an aperture in an opaque structure. The opaque structure may be formed from an opaque material or a transparent material with an opaque coating. The light sensor may be mounted in a support structure that has been optically aligned with the aperture. The light sensor or the support structure may include extended portions that are transparent to ultraviolet light. Ultraviolet light may be transmitted through the extended portions to cure adhesive that attaches the light sensor or the support structure to the opaque structure. The light sensor may be optically aligned with the aperture by viewing the aperture through an opening in the support structure, by viewing the alignment features on the light sensor through the aperture or by gathering alignment data using the light sensor during alignment operations.