Patents by Inventor Ashwin CHOCKALINGHAM

Ashwin CHOCKALINGHAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964359
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: April 23, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ashwin Chockalingham, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
  • Publication number: 20200055161
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Ashwin CHOCKALINGHAM, Mahendra C. ORILALL, Mayu YAMAMURA, Boyi FU, Rajeev BAJAJ, Daniel REDFIELD