Abstract: Method and apparatus for measuring or determining characteristics, such as the actual effective width of a first conductive medium of a given design width produced by an integrated circuit process. The first conductive medium is formed apart from and parallel to a second and similar conductive medium of a given design width on an insulating medium which is disposed on a semiconductor substrate. The substrate has a first conductivity region and first and second parallel strips of a second and opposite conductivity disposed at one surface thereof within the first conductivity region for forming a channel of a given length. The first and second conductive media are arranged orthogonal to the first and second strips. A first voltage is applied between the first conductive medium and the first parallel strip and a second voltage is applied between the second conductive medium and the first parallel strip.