Patents by Inventor Asia Pacific Microsystems, Inc.

Asia Pacific Microsystems, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Combo Transducer and Combo Transducer Package
    Publication number: 20130205899
    Abstract: A combo transducer includes a base, a proof mass, a membrane unit and a plurality of transducing components. The base is formed with an aperture. The proof mass is disposed in the aperture and has a surface that is formed with a cavity. The membrane unit includes a supporting part connected to the base, a covering part disposed to cover the surface of the proof mass, and a resilient linking part interconnecting the supporting part and the covering part such that the proof mass is movable relative to the base. The transducing components are disposed at the membrane unit. At least one of the transducing components is disposed at the covering part and is registered with the cavity.
    Type: Application
    Filed: February 11, 2013
    Publication date: August 15, 2013
    Applicant: ASIA PACIFIC MICROSYSTEMS, INC.
    Inventor: Asia Pacific Microsystems, Inc.