Patents by Inventor Asif JAKWANI

Asif JAKWANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER MODULES AND RELATED METHODS
    Publication number: 20220293499
    Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 15, 2022
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jinchang ZHOU, Asif JAKWANI, Chee Hiong CHEW, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO
  • Quad leadframe packages and related methods
    Patent number: 11373939
    Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 28, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jinchang Zhou, Asif Jakwani, Chee Hiong Chew, Yusheng Lin, Sravan Vanaparthy, Silnore Tejero Sabando
  • POWER MODULES AND RELATED METHODS
    Publication number: 20200098671
    Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 26, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jinchang ZHOU, Asif JAKWANI, Chee Hiong CHEW, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO