Patents by Inventor Asit Biswas

Asit Biswas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7041250
    Abstract: A process for producing a binder phase free fine grained refractory metal compact at temperatures that are less than about 80 percent of the melting point of the refractory metal. A refractory metal is mixed with a metallic reagent to produce a mixture with a low melting point, and formed into a preform. The metallic reagent has limited solubility in the solid phase refractory metal. The refractory metal-metallic reagent mixture forms a liquid phase at the boundaries of the refractory metal grains. The metallic reagent diffuses into the boundaries of the refractory grains leaving a solid refractory-reagent phase at the boundaries between the grains. As heating continues at less than about 80 percent of the melting point of the refractory metal, consolidation takes place with minimum grain growth until the solid refractory-reagent phase substantially disappears and a refractory metal compact without a binder phase is recovered.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: May 9, 2006
    Assignee: Powdermet, Inc.
    Inventors: Andrew J. Sherman, Asit Biswas
  • Publication number: 20030039573
    Abstract: A process for producing a binder phase free fine grained refractory metal compact at temperatures that are less than about 80 percent of the melting point of the refractory metal. A refractory metal is mixed with a metallic reagent to produce a mixture with a low melting point, and formed into a preform. The metallic reagent has limited solubility in the solid phase refractory metal. The refractory metal-metallic reagent mixture forms a liquid phase at the boundaries of the refractory metal grains. The metallic reagent diffuses into the boundaries of the refractory grains leaving a solid refractory-reagent phase at the boundaries between the grains. As heating continues at less than about 80 percent of the melting point of the refractory metal, consolidation takes place with minimum grain growth until the solid refractory-reagent phase substantially disappears and a refractory metal compact without a binder phase is recovered.
    Type: Application
    Filed: August 22, 2002
    Publication date: February 27, 2003
    Inventors: Andrew J. Sherman, Asit Biswas