Patents by Inventor Asri bin Yusof

Asri bin Yusof has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a package-on-package structure
    Patent number: 7901988
    Abstract: A method for forming a package-on-package structure is disclosed. The method comprises the step of providing a first semiconductor package. The first semiconductor package has at least one encapsulation layer formed on at least one side of the first semiconductor package. The method also involves the step of securing the first semiconductor package to a surface. The surface is adapted for receiving the first semiconductor package. The method further involves the step of reducing the thickness of the at least one encapsulation layer to a predetermined thickness. The at least one encapsulation layer having a portion distal the surface removed. More specifically, the thickness of the at least one encapsulation layer is reduced for providing a predetermined clearance from a second semiconductor package attachable to the first semiconductor package.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: March 8, 2011
    Assignee: EEMS Asia Pte Ltd
    Inventors: Asri bin Yusof, Vincent Ho
  • METHOD FOR FORMING A PACKAGE-ON-PACKAGE STRUCTURE
    Publication number: 20100032847
    Abstract: A method for forming a package-on-package structure is disclosed. The method comprises the step of providing a first semiconductor package. The first semiconductor package has at least one encapsulation layer formed on at least one side of the first semiconductor package. The method also involves the step of securing the first semiconductor package to a surface. The surface is adapted for receiving the first semiconductor package. The method further involves the step of reducing the thickness of the at least one encapsulation layer to a predetermined thickness. The at least one encapsulation layer having a portion distal the surface removed. More specifically, the thickness of the at least one encapsulation layer is reduced for providing a predetermined clearance from a second semiconductor package attachable to the first semiconductor package.
    Type: Application
    Filed: August 8, 2008
    Publication date: February 11, 2010
    Inventors: Asri bin Yusof, Vincent Ho