Abstract: Sensing apparatus includes a projector, which projects toward a target a pattern of spots extending over a predefined angular range about a projection axis. An imaging assembly includes an image sensor and objective optics, which form on the image sensor an image of the target along an imaging axis, which is offset transversely relative to the projection axis. A processor is configured to process signals output by the image sensor so as generate, while the target is within a first span of distances from the apparatus, a depth map of the target responsively to shifts of the spots in the image, and to estimate, while the target is within a second span of distances, nearer to the apparatus than the first span, a distance to the target from the apparatus by detecting in the image a part of the pattern located at an edge of the angular range.

Abstract: An optoelectronic apparatus includes an array of emitters configured to emit beams of optical radiation. An optical substrate is mounted over the array. An optical metasurface is disposed on the optical substrate and configured to collimate and split each of the emitted beams into a respective group of collimated sub-beams, and to direct the collimated sub-beams toward a target to form a pattern of spots on the target.

Abstract: An optoelectronic apparatus includes a semiconductor substrate and multiple arrays of emitters disposed on the semiconductor substrate and configured to emit beams of optical radiation. An optical substrate is mounted over the semiconductor substrate. An optical metasurface disposed on the optical substrate includes multiple optical apertures. Each aperture is configured to receive, collimate and split the beams emitted by a respective array of the emitters into a respective group of collimated sub-beams, so as to direct the collimated sub-beams toward a target at different, respective angles to form a pattern of spots on the target.

Abstract: An optoelectronic apparatus includes a semiconductor substrate and an array of emitters disposed on the semiconductor substrate and configured to emit beams of optical radiation having respective chief rays. An optical diffuser is mounted over the semiconductor substrate and configured to diffuse the beams. Microlenses are disposed between the semiconductor substrate and the optical diffuser in respective alignment with the emitters and configured to steer the beams at different, respective angles, which are selected so that at least some of the chief rays cross one another before passing through the diffuser.

Abstract: An optoelectronic apparatus includes an array of emitters configured to emit beams of optical radiation. An optical substrate is mounted over the array. An optical metasurface is disposed on the optical substrate and configured to collimate and split each of the emitted beams into a respective group of collimated sub-beams, and to direct the collimated sub-beams toward a target to form a pattern of spots on the target.

Abstract: A method for depth mapping includes providing a depth mapping device comprising a projector, which is configured to project a pattern of optical radiation onto a target area over a first field of view about a projection axis, and a camera, which is configured to capture images of the target area within a second field of view, narrower than the first field of view, about a camera axis, which is offset transversely relative to the projection axis. The projector projects the pattern onto first and second planes at first and second distances from the camera, and the camera captures first and second reference images containing first and second parts of the pattern on the first and second planes, respectively. The first and second reference images are combined to produce an extended reference image including both the first and second parts of the pattern.

Abstract: One disclosed embodiment includes techniques for temperature-dependent reference image correction in structured light projectors that may be used for generating three-dimensional (3D) scene depth maps. The techniques disclosed herein include receiving an indication of a temperature (e.g., an actual current operating temperature or a change in the current operating temperature relative to an established reference temperature) associated with one or more components of a projector and then determining, based on the temperature indication, an amount of adjustment needed to correct a reference pattern image based on an estimated effective focal length change of the projector. Next, a reference pattern image may be appropriately adjusted, e.g.

Abstract: One disclosed embodiment includes techniques for temperature-dependent reference image correction in structured light projectors that may be used for generating three-dimensional (3D) scene depth maps. The techniques disclosed herein include receiving an indication of a temperature (e.g., an actual current operating temperature or a change in the current operating temperature relative to an established reference temperature) associated with one or more components of a projector and then determining, based on the temperature indication, an amount of adjustment needed to correct a reference pattern image based on an estimated effective focal length change of the projector. Next, a reference pattern image may be appropriately adjusted, e.g.

Abstract: Sensing apparatus includes a projector, which projects toward a target a pattern of spots extending over a predefined angular range about a projection axis. An imaging assembly includes an image sensor and objective optics, which form on the image sensor an image of the target along an imaging axis, which is offset transversely relative to the projection axis. A processor is configured to process signals output by the image sensor so as generate, while the target is within a first span of distances from the apparatus, a depth map of the target responsively to shifts of the spots in the image, and to estimate, while the target is within a second span of distances, nearer to the apparatus than the first span, a distance to the target from the apparatus by detecting in the image a part of the pattern located at an edge of the angular range.

Abstract: Depth mapping apparatus includes an illumination assembly, which directs modulated optical radiation toward a target scene, and a camera, which captures a two-dimensional image of the target scene. A range sensor senses respective times of flight of photons reflected from a matrix of locations disposed across the target scene. A processor derives first depth coordinates of the matrix of locations responsively to the respective times of flight, derives second depth coordinates of the matrix of locations responsively to a transverse disparity between features in the two-dimensional image and corresponding reference features in a reference image, computes a disparity correction function based on a difference between the first and the second depth coordinates at the matrix of locations, corrects the transverse disparity between the two-dimensional image and the reference image using the disparity correction function, and generates a depth map of the target scene based on the corrected transverse disparity.

Abstract: An optical apparatus includes a transparent envelope having opposing first and second faces. An electro-optic material is contained within the transparent envelope and includes molecules oriented in respective predefined directions selected so as to form a geometric-phase structure across an area of the transparent envelope. First and second transparent electrodes are disposed respectively across the first and second faces of the transparent envelope. A controller is coupled to apply a voltage between the first and second transparent electrodes that is sufficient to displace the molecules of the electro-optic material from the predefined directions.

Abstract: An opto-electronic device includes a semiconductor substrate having a planar surface. An emitter is formed on the substrate and configured to emit a beam of light away from the planar surface. A reflective layer is formed on the planar surface adjacent to the emitter. A transparent layer is formed over the planar surface and has a curved outer surface including a first segment positioned vertically over the emitter and configured to internally reflect the emitted beam of light toward the reflective layer, and a second segment positioned and configured to collimate and transmit the beam reflected from the reflective layer.

Abstract: An electronic device may have a display with an array of pixels for displaying images. The display may have a window region. During operation, a component such as an optical component may operate through the window region. The window region may overlap a movable portion of the display. The window region may be operated in open and closed states. In the closed state, the movable portion of the display overlaps the window region and pixels in the movable display portion emit light through the window region. In the open state, the movable portion of the display is moved away from the window region so that light for the optical component may pass through the window region. The optical component may be a camera or other component that receives light through the window region or may be an optical component that emits light through the window region.

Abstract: Imaging apparatus includes a housing, with imaging optics mounted in the housing and configured to form an optical image, at a focal plane within the housing, of an object outside the housing. An image sensor, including a matrix of detector elements, is positioned at the focal plane in alignment with the imaging optics and is configured to output an electronic image signal in response to optical radiation that is incident on the detector elements. At least one emitter is fixed within the housing and is configured to emit a test beam toward one or more reflective surfaces within the housing, which reflect the test beam toward the image sensor. A processor is configured to process the electronic image signal output by the image sensor in response to the reflected test beam so as to detect a change in the alignment of the image sensor with the imaging optics.

Abstract: An opto-electronic device includes a semiconductor substrate having a planar surface. An emitter is formed on the substrate and configured to emit a beam of light away from the planar surface. A reflective layer is formed on the planar surface adjacent to the emitter. A transparent layer is formed over the planar surface and has a curved outer surface including a first segment positioned vertically over the emitter and configured to internally reflect the emitted beam of light toward the reflective layer, and a second segment positioned and configured to collimate and transmit the beam reflected from the reflective layer.

Abstract: Imaging apparatus includes a housing, with imaging optics mounted in the housing and configured to form an optical image, at a focal plane within the housing, of an object outside the housing. An image sensor, including a matrix of detector elements, is positioned at the focal plane in alignment with the imaging optics and is configured to output an electronic image signal in response to optical radiation that is incident on the detector elements. At least one emitter is fixed within the housing and is configured to emit a test beam toward one or more reflective surfaces within the housing, which reflect the test beam toward the image sensor. A processor is configured to process the electronic image signal output by the image sensor in response to the reflected test beam so as to detect a change in the alignment of the image sensor with the imaging optics.

Abstract: Imaging apparatus includes an illumination subassembly, which is configured to project onto an object a pattern of monochromatic optical radiation in a given wavelength band. An imaging subassembly includes an image sensor, which is configured both to capture a first, monochromatic image of the pattern on the object by receiving the monochromatic optical radiation reflected from the object and to capture a second, color image of the object by receiving polychromatic optical radiation, and to output first and second image signals responsively to the first and second images, respectively. A processor is configured to process the first and second signals so as to generate and output a depth map of the object in registration with the color image.

Abstract: Imaging apparatus includes an illumination subassembly, which is configured to project onto an object a pattern of monochromatic optical radiation in a given wavelength band. An imaging subassembly includes an image sensor, which is configured both to capture a first, monochromatic image of the pattern on the object by receiving the monochromatic optical radiation reflected from the object and to capture a second, color image of the object by receiving polychromatic optical radiation, and to output first and second image signals responsively to the first and second images, respectively. A processor is configured to process the first and second signals so as to generate and output a depth map of the object in registration with the color image.

Abstract: Imaging apparatus includes an illumination subassembly, which is configured to project onto an object a pattern of monochromatic optical radiation in a given wavelength band. An imaging subassembly includes an image sensor, which is configured both to capture a first, monochromatic image of the pattern on the object by receiving the monochromatic optical radiation reflected from the object and to capture a second, color image of the object by receiving polychromatic optical radiation, and to output first and second image signals responsively to the first and second images, respectively. A processor is configured to process the first and second signals so as to generate and output a depth map of the object in registration with the color image.

Abstract: Imaging apparatus includes an illumination subassembly, which is configured to project onto an object a pattern of monochromatic optical radiation in a given wavelength band. An imaging subassembly includes an image sensor, which is configured both to capture a first, monochromatic image of the pattern on the object by receiving the monochromatic optical radiation reflected from the object and to capture a second, color image of the object by receiving polychromatic optical radiation, and to output first and second image signals responsively to the first and second images, respectively. A processor is configured to process the first and second signals so as to generate and output a depth map of the object in registration with the color image.