Patents by Inventor Astha SHARMA

Astha SHARMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11681608
    Abstract: A system may execute a pipelined multiple-tier test stack to support migration of computing resources via a migratory data stream. Via the pipelined multiple-tier test stack, the system may perform extract, transform, and load operations on the migratory data stream. The extract, transform, and load operations may be used to identify applications that may undergo testing. At a generation tier of the pipelined multiple-tier test stack, the system may generate test scripts, which may be used to test the application. The tests may be validated by the system via a validation tier of the pipelined multiple-tier test stack. To govern the operations, the pipelined multiple-tier test stack may rely on a multi-point reference data model.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: June 20, 2023
    Assignee: ACCENTURE GLOBAL SOLUTIONS LIMITED
    Inventors: Astha Sharma, Himanshu Kumar, Anand Narasimhamurthy, Anuj Kumar Mishra, Pulkit Duggal
  • Publication number: 20220283933
    Abstract: A system may execute a pipelined multiple-tier test stack to support migration of computing resources via a migratory data stream. Via the pipelined multiple-tier test stack, the system may perform extract, transform, and load operations on the migratory data stream. The extract, transform, and load operations may be used to identify applications that may undergo testing. At a generation tier of the pipelined multiple-tier test stack, the system may generate test scripts, which may be used to test the application. The tests may be validated by the system via a validation tier of the pipelined multiple-tier test stack. To govern the operations, the pipelined multiple-tier test stack may rely on a multi-point reference data model.
    Type: Application
    Filed: August 16, 2021
    Publication date: September 8, 2022
    Applicant: Accenture Global Solutions Limited
    Inventors: Astha SHARMA, Himanshu KUMAR, Anand NARASIMHAMURTHY, Anuj KUMAR MISHRA, Pulkit DUGGAL
  • Patent number: 10871720
    Abstract: In embodiments of the present disclosure, a vibrator is used to generate a vibration wave with a variable frequency that can agitate and facilitate the circulation of the processing fluids, thereby enhancing the uniformity and efficiency of the resulting semiconductor device features, the vibrator may be a piezoelectric vibrator or other similar vibrators. In some embodiments, the vibration of the processing fluids can facilitate the processing fluids in circulating in and out of narrow channels or features, or the vibration of the processing fluids can facilitate the bubbling out of the microbubbles entrapped in the processing liquid or entrapped between the surface of the semiconductor wafer and the processing liquid. In another embodiment, the vibrations generated by the vibrator have vibration waves with a variable frequency to avoid resonance that may damage the semiconductor wafer and the features thereon.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Astha Sharma, Chia-Hung Lai, Hsin-Kuo Chang, Jaw-Lih Shih, Hong-Hsing Chou
  • Publication number: 20160096155
    Abstract: In embodiments of the present disclosure, a vibrator is used to generate a vibration wave with a variable frequency that can agitate and facilitate the circulation of the processing fluids, thereby enhancing the uniformity and efficiency of the resulting semiconductor device features, the vibrator may be a piezoelectric vibrator or other similar vibrators. In some embodiments, the vibration of the processing fluids can facilitate the processing fluids in circulating in and out of narrow channels or features, or the vibration of the processing fluids can facilitate the bubbling out of the microbubbles entrapped in the processing liquid or entrapped between the surface of the semiconductor wafer and the processing liquid. In another embodiment, the vibrations generated by the vibrator have vibration waves with a variable frequency to avoid resonance that may damage the semiconductor wafer and the features thereon.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 7, 2016
    Inventors: Astha SHARMA, Chia-Hung LAI, Hsin-Kuo CHANG, Jaw-Lih SHIH, Hong-Hsing CHOU