Abstract: A surface modification sheet (X) of the present invention includes a release sheet (10) and a surface modification layer (20) thereon. The surface modification layer (20) contains a polymer having a side chain containing an ethylenic double bond. The side chain of the polymer preferably includes a unit derived from an isocyanate compound containing the ethylenic double bond.

Abstract: A surface-modified thermoplastic resin in which sufficient bonding strength is applied to a thermoplastic resin and a method thereof are provided. A bonded structure capable of exhibiting sufficient bonding strength and a method thereof are provided. A thermal transfer surface-modifying sheet that can be preferably used in the method for manufacturing a surface-modified thermoplastic resin is provided. A thermoplastic resin with a thermal transfer surface-modifying sheet including the thermal transfer surface-modifying sheet is provided. The method for manufacturing a surface-modified thermoplastic resin, in which an easy adherence layer is laminated on a thermoplastic resin having a melting point of T° C., the method includes: providing the easy adherence layer on at least a part of a surface of the thermoplastic resin; and performing heat welding at a temperature equal to or higher than (T?50)° C.

Abstract: A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer to be then heated at 80° C. or more to bring the reinforcing sheet into close contact with the resin molded article. The constraining layer may be formed from at least one of a glass cloth, a resin impregnated glass cloth, a non-woven fabric, a metal foil, a carbon fiber or a polyester film. The reinforcing layer is formed of an adhesive composition containing styrene-ethylene-butylene-styrene copolymer or styrene-ethylene-propylene-styrene copolymer, a tackifier and a filler. When the reinforcing sheet is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C.

Abstract: A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer. When the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more. High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C.

Abstract: A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer. When the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more. High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C.

Abstract: A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer. When the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more. High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C. for 1 hour)×100.