Abstract: Three-dimensional antennas incorporate a stack of planar wiring boards, with conductive metallization on each board and electrical connectivity between conductive regions on adjacent boards. In one example of the disclosed technology, a three-dimensional antenna is formed from a stack of planar wiring boards, where each includes one or more disjoint metallizations in electrical contact with at least one disjoint metallization on an adjacent one of the planar wiring boards. Associated methods and variants are also disclosed.

Abstract: Three-dimensional antennas incorporate a stack of planar wiring boards, with conductive metallization on each board and electrical connectivity between conductive regions on adjacent boards. In one example of the disclosed technology, a three-dimensional antenna is formed from a stack of planar wiring boards, where each includes one or more disjoint metallizations in electrical contact with at least one disjoint metallization on an adjacent one of the planar wiring boards. Associated methods and variants are also disclosed.

Abstract: In some embodiments, an apparatus, system, and method for high frequency signal distribution may input a source signal and provide a plurality of outputs having equal phase and magnitude using a pie-divider 205. The pie-divider 205 may include an input section 305, 315, a body section 320, and a plurality of outputs 310. The body section 320 of the pie-divider 205 may have a generally pie-shaped geometry and distribute an input signal to each of the outputs 310 equally. The pie-divider 205 may comprise a conductive material. Additionally, other embodiments are described and claimed.