Patents by Inventor Atai ZIV

Atai ZIV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210084795
    Abstract: An active fluid cooled heatsink is provided. The heatsink includes a heatsink body having a cavity therein, the heatsink body having at least a top internal surface and a bottom internal surface; at least an inlet for receiving fluid at a first temperature into the cavity; at least an outlet for expelling fluid at a second temperature from the cavity; a plurality of foils within the cavity, disposed in contact with the bottom internal surface of the heatsink body, where the plurality of foils direct the flow of the fluid; and a surface area on which to mount a plurality of resource adapters.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 18, 2021
    Applicant: SolidRun Ltd.
    Inventors: Atai ZIV, Rabeeh KHOURY, Kossay OMARY, Philip SHAHEEN, Alon ROTMAN
  • Publication number: 20210004658
    Abstract: A system and method for provisioning of artificial intelligence accelerator (AIA) resources. The method includes receiving a request for an NPU allocation from a client device; determining an available NPU based on a scanning of a network to discover NPU resources; and allocating the available NPU to the client device.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Applicant: SolidRun Ltd.
    Inventors: Atai ZIV, Rabeeh KHOURY, Kossay OMARY, Avi LEVY
  • Publication number: 20200375067
    Abstract: An active fluid cooled heatsink assembly for modular components is disclosed. The active fluid heatsink assembly includes a fluid cooled heatsink, the heatsink further comprising: an inlet, an outlet, and a surface, wherein fluid passing through the heatsink is received by the inlet at a first temperature and expelled from the outlet at a second temperature, wherein the second temperature is higher than the first temperature; and at least one resource adapter, each resource adapter further comprising a first surface having a shape which conforms to a corresponding electronic resource of at least one electronic resource and a second surface having a shape corresponding to at least a portion of the surface of the fluid cooled heatsink, wherein each resource adapter exchanges heat from the corresponding electronic resource to the fluid cooled heatsink, and wherein the at least one resource adapter is mounted on the surface of the fluid cooled heatsink.
    Type: Application
    Filed: May 28, 2020
    Publication date: November 26, 2020
    Applicant: SolidRun Ltd.
    Inventors: Atai ZIV, Rabeeh KHOURY, Kossay OMARY, Avi LEVY
  • Publication number: 20190116693
    Abstract: A cooling device for cooling a heat generating load, the device having an enclosed housing defining a continuous cooling volume for flowing a coolant between an inlet and an outlet. The housing featuring at least one surface that is configured for facilitating heat exchange sequence with the heat generating load such that the coolant is configured to absorb generated heat.
    Type: Application
    Filed: March 30, 2017
    Publication date: April 18, 2019
    Inventors: Haim DROR, Atai ZIV, Rabeeh KHOURY, Kossay OMARY