Abstract: High performance interconnect devices, structures, and fabrication methods are provided herein. According to some embodiments of the present invention, an interconnect device used to connect components or route signals in an integrated circuit can comprise multiple conductors. A first conductor of the interconnect device can define a first conductor axis, and a second conductor of the interconnect device can define a second conductor axis. The second conductor can be proximate the first conduct such that first conductor axis is substantially coaxially situated relative to the second conductor axis to provide a high performance interconnect having a coaxial alignment. The first conductor and the second conductor can define a gap disposed between and separating the conductors. Other embodiments are also claimed and described.

Abstract: Integrated circuit interconnection devices and methods are provided. An interconnection to connect components can comprise a first portion, a second portion, and a joining portion. The first portion can extend from a first component, and the first portion can be made with a single conductor. The second portion can extend from a second component, and the second portion can be made with the single conductor. The joining section can be disposed between the first portion and the second portion so that the first component and second component are interconnected to each other to form an interconnect. The joining section can be made of the single conductor so that the interconnect structure consists only of the single conductor. An interconnect can also be formed with two portions, and be formed to have a high-aspect ratio. Other embodiments are also claimed and described.

Abstract: High performance interconnect devices, structures, and fabrication methods are provided herein. According to some embodiments of the present invention, an interconnect device used to connect components or route signals in an integrated circuit can comprise multiple conductors. A first conductor of the interconnect device can define a first conductor axis, and a second conductor of the interconnect device can define a second conductor axis. The second conductor can be proximate the first conduct such that first conductor axis is substantially coaxially situated relative to the second conductor axis to provide a high performance interconnect having a coaxial alignment. The first conductor and the second conductor can define a gap disposed between and separating the conductors. Other embodiments are also claimed and described.