Patents by Inventor Athanase Contolatis

Athanase Contolatis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional package for monolithic microwave/millimeterwave integrated circuits
    Patent number: 5545924
    Abstract: A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lines disposed over its surfaces. The mating substrate mounted substantially vertical in a base substrate which also has transmission lines for carrying microwave/millimeterwave signals. The transmission lines on both substrates are put in electrical contact and microwave/millimeterwave signals are transmitted between the substrates with a minimum of signal loss or reflection.
    Type: Grant
    Filed: August 5, 1993
    Date of Patent: August 13, 1996
    Assignee: Honeywell Inc.
    Inventors: Athanase Contolatis, Vladimir Sokolov