Abstract: An integrated DRAM memory component has sense amplifiers which, respectively within the framework of the integrated component, are formed from a multiplicity of transistor structures, arranged regularly in cell arrays, and signal interconnect structures with amplification transistors for bit line signal amplification. The amplification transistors are of identical design and they lie opposite one another in pairs in adjacent transistor rows. Signal interconnects, which are associated with the transistor rows and run parallel thereto, supply actuation signals. The signal interconnects for the actuation signals have the same arrangement symmetry as the amplification transistors, which means that the amplification transistors in adjacent transistor rows are in the same signal interconnect proximity.

Abstract: An integrated DRAM memory component has sense amplifiers which, respectively within the framework of the integrated component, are formed from a multiplicity of transistor structures, arranged regularly in cell arrays, and signal interconnect structures with amplification transistors for bit line signal amplification. The amplification transistors are of identical design and they lie opposite one another in pairs in adjacent transistor rows. Signal interconnects, which are associated with the transistor rows and run parallel thereto, supply actuation signals. The signal interconnects for the actuation signals have the same arrangement symmetry as the amplification transistors, which means that the amplification transistors in adjacent transistor rows are in the same signal interconnect proximity.

Abstract: The invention provides a method in which a binary memory cell signal from a; least one memory cell is applied to at least one bit line pair (201t, 201b), the binary memory cell signal from the memory tell is switched through via the bit line pair (201t, 201b) to at least one sense amplifier (202), a binary output signal of the sense amplifier (202) is switched through to a local data line pair (205) as a binary intermediate signal, the binary intermediate signal on the local data line pair (205) is switched through to at least one main data line pair (208) by means of a main data line switching transistor pair (209) in a manner dependent on a row control signal fed via a row control line (210), the main data line switching transistor pair (209) being arranged in the through-plating regions formed between the memory cell arrays.

Abstract: The invention features a method for reading and storing a binary memory cell signal where a signal transit time of the binary memory cell signal between one memory cell and an output terminal is reduced. The method includes applying a binary memory cell signal to a bit line pair; switching through the binary memory cell signal from the bit line pair to a local data line pair via a sense amplifier; switching through the amplified binary memory cell signal by a main data switching unit from the local data line to a main data line pair; and outputting the amplified, transferred binary memory cell signal via the first main data line and the second main data line pairs.

Abstract: The integrated DRAM memory module has sense amplifiers which are each formed, in the integrated module, from a multiplicity of transistor structures that are arranged regularly in cell arrays and include amplification transistors for bit line signal amplification. The amplification transistors lie opposite one another in pairs, are structurally identical, and are arranged equally spaced apart in rows. Voltage equalization transistors ensure voltage equalization between sense amplifier drive signals. The cell array order provides for each row with amplification transistors situated in a structurally identical transistor environment to be interrupted in a predetermined period by voltage equalization transistors.

Abstract: The invention provides a method in which a binary memory cell signal from a; least one memory cell is applied to at least one bit line pair (201t, 201b), the binary memory cell signal from the memory tell is switched through via the bit line pair (201t, 201b) to at least one sense amplifier (202), a binary output signal of the sense amplifier (202) is switched through to a local data line pair (205) as a binary intermediate signal, the binary intermediate signal on the local data line pair (205) is switched through to at least one main data line pair (208) by means of a main data line switching transistor pair (209) in a manner dependent on a row control signal fed via a row control line (210), the main data line switching transistor pair (209) being arranged in the through-plating regions formed between the memory cell arrays.

Abstract: The invention features a method for reading and storing a binary memory cell signal where a signal transit time of the binary memory cell signal between one memory cell and an output terminal is reduced. The method includes applying a binary memory cell signal to a bit line pair; switching through the binary memory cell signal from the bit line pair to a local data line pair via a sense amplifier; switching through the amplified binary memory cell signal by a main data switching unit from the local data line to a main data line pair; and outputting the amplified, transferred binary memory cell signal via the first main data line and the second main data line pairs.

Abstract: The integrated DRAM memory module has sense amplifiers which are each formed, in the integrated module, from a multiplicity of transistor structures that are arranged regularly in cell arrays and include amplification transistors for bit line signal amplification. The amplification transistors lie opposite one another in pairs, are structurally identical, and are arranged equally spaced apart in rows. Voltage equalization transistors ensure voltage equalization between sense amplifier drive signals. The cell array order provides for each row with amplification transistors situated in a structurally identical transistor environment to be interrupted in a predetermined period by voltage equalization transistors.

Abstract: The semiconductor memory configuration has at least two memory cell arrays. The open area between the strips of the sense-amp transistors in the two memory cell arrays contains dummy transistors. This avoids proximity effects at the edges of the sense-amp transistors adjoining the open area. The sense-amp transistors and the dummy transistors are arranged in a common, continuous diffusion region.

Abstract: The sense-amp transistors of the sense amplifier configuration are arranged in a common continuous diffusion region. The drivers are disposed directly adjacent and parallel to the diffusion region. A short local connection between the sense-amp transistors and the drivers is thereby ensured.

Abstract: The integrated semiconductor memory configuration has a plurality of memory cell fields connected to one another by low-resistance supply lines forming a power network. The power network is connected to a voltage generator via a high-resistance supply line. An activated memory cell field is supplied, for the purpose of such activation, by self-buffering from the other memory cell fields (1-5, 7-8).