Abstract: A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

Abstract: A method for forming an integrated circuit includes providing an array of detectors proximate an outer surface of a first substrate layer. The array of detectors operate to detect the presence or absence of one or more wavelengths within a spectrum of transmitted energy. One or more filters are provided proximate a second substrate layer. The one or more filters operate to affect the spectrum of transmitted energy through the one or more filters. The second substrate layer is proximate to the outer surface of the first substrate layer to enclose the array of detectors in a vacuum environment.

Abstract: A method for manufacturing optically-transparent lids includes etching sub-wavelength structures on a surface of a lid wafer. The structures may be arrayed in a hexagonally closed-packed pattern.

Abstract: A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

Abstract: A sensor for detecting a target matter includes a chemical sensitive layer that is operable to react when exposed to the target matter and a piezoresistive material coupled to the chemical sensitive layer. The chemical sensitive layer is configured such that the reaction of the target matter with the chemical sensitive layer creates an interfacial tension at the interface of the chemical sensitive layer and the piezoresistive material that changes the electrical resistance of the piezoresistive material. However, the chemical sensitive layer is configured such that the reaction of the target matter with the chemical sensitive layer does not affect the bulk properties of the chemical sensitive layer enough to change the electrical resistance of the piezoresistive material. The sensor also includes an electrical circuit coupled to the piezoresistive material that is operable to detect the change in the electrical resistance of the piezoresistive material due to the interfacial tension.

Abstract: A method for manufacturing optically-transparent lids includes etching sub-wavelength structures on a surface of a lid wafer. The structures may be arrayed in a hexagonally closed-packed pattern.

Abstract: A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

Abstract: A method for forming an integrated circuit includes providing an array of detectors proximate an outer surface of a first substrate layer. The array of detectors operate to detect the presence or absence of one or more wavelengths within a spectrum of transmitted energy. One or more filters are provided proximate a second substrate layer. The one or more filters operate to affect the spectrum of transmitted energy through the one or more filters. The second substrate layer is proximate to the outer surface of the first substrate layer to enclose the array of detectors in a vacuum environment.

Abstract: An infrared radiation emitter is provided that is capable of producing infrared radiation modulating at high frequency. The IR emitter includes a low-thermal-mass resistive membrane that is suspended by long thermal isolation arms over a substrate. The membrane is suspended over the substrate such that a resonant emitting cavity is formed between the membrane and the substrate. The low-mass, thermally isolated membrane design maximizes the temperature change induced by Joule heating of the resistive membrane and allows the emitted IR radiation to be modulated at high frequencies.