Patents by Inventor Atif SYED

Atif SYED has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230399136
    Abstract: An item packing system (100) configured to sort and/or pack vine fruit such as bunches of grapes into containers is disclosed herein. The system comprises a first robotic arm (110) comprising at least one first end effector (120) for cutting vine fruit, a second robotic arm (114) comprising at least one second end effector (122) for holding and manipulating a vine fruit for packing into a container, at least one camera (155) for providing image data of the vine fruit, and a controller configured to receive the image data of the vine fruit and to make a determination of the weight of the vine fruit based on the received image data. The controller is configured to control the at least one first end effector of the first robotic arm to cut the vine fruit based on the determined weight of the vine fruit, and the controller is configured to control the at least one second end effector of the second robotic arm to hold and manipulate the cut vine fruit into a container (142).
    Type: Application
    Filed: October 26, 2021
    Publication date: December 14, 2023
    Inventors: Joel Maafo BUDU, Raviteja BURUGU, Jesse Kwabena OPOKU, Mark James BECKWITH, Atif SYED, Adnan KHADER SYED, Thierry Joseph Valery GARCIA
  • Publication number: 20230390923
    Abstract: An item picking system configured to pick items from a collection region for placing said items into an item container, the system comprising a robotic arm. One or more end effectors coupled to the robotic arm for holding and manipulating an item, wherein at least one of the end effectors comprises a contact pressure sensing assembly including a piezoresistive sensor configured to obtain piezoresistive signals indicative of contact pressure between said sensor and an item held by said end effector. Signal processing circuitry configured to process the piezoresistive signals, the signal processing circuitry comprising a differential amplifier having a first input terminal coupled to the sensor to receive the piezoresistive signals therefrom.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 7, 2023
    Inventors: Thierry GARCIA, François MORINI, Atif SYED, Mark BECKWITH, Jesse OPOKU
  • Publication number: 20230390941
    Abstract: An item packing system configured to sort and/or pack items into item containers, the system comprising a robotic arm. At least one end effector for holding and manipulating an item to be sorted and/or packed, wherein at least one end effector comprises a pressure sensing assembly. A controller configured to receive sensor signals from the pressure sensing assembly to obtain an indication of a magnitude of contact pressure for contact between the end effector and the item held by the end effector. A direction of contact pressure for contact between the end effector and the item held by the end effector, wherein the controller is configured to determine whether the end effector is correctly holding the item based on the indication of the magnitude of the contact pressure and the indication of the direction of contact pressure.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 7, 2023
    Inventors: Jesse OPOKU, François MORINI, Mark BECKWITH, Atif SYED
  • Patent number: 11685141
    Abstract: A flexible conductive or electronic device comprising a polymer base, a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer and a conductive layer which is bonded to the poly-para-xylylene layer by a second adhesive layer.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: June 27, 2023
    Assignee: WOOTZANO LIMITED
    Inventors: Atif Syed, Enrico Mastropaolo
  • Publication number: 20220304150
    Abstract: A substrate for use in an electronic skin is disclosed herein. The substrate comprises a base polymer layer, and a first intermediate polymer layer attached to the base polymer layer by a first adhesive layer. The first intermediate polymer layer comprises a first intermediate polymer in which electron-rich groups are linked directly to one another or by optionally substituted C1-4 alkanediyl groups. A first conductive layer is attached to the first intermediate polymer layer by a second adhesive layer or by multiple second adhesive layers between which a second intermediate polymer layer or a second conductive layer is disposed.
    Type: Application
    Filed: May 7, 2020
    Publication date: September 22, 2022
    Inventors: Atif SYED, Enrico MASTROPAOLO, Mark James BECKWITH
  • Publication number: 20220227952
    Abstract: A substrate for use in an electronic skin is disclosed herein. The substrate comprises a base polymer layer, a first intermediate polymer layer is attached to the base polymer layer by a first adhesive layer, and the first intermediate polymer layer comprises a first intermediate polymer in which electron-rich groups are linked directly to one another or by an optionally substituted C1-4 alkanediyl groups. A first conductive layer is attached to the first intermediate polymer layer by a second adhesive layer or by multiple second adhesive layers between which a second intermediate polymer layer or a second conductive layer is disposed. Nanowires are present on the first conductive layer.
    Type: Application
    Filed: May 7, 2020
    Publication date: July 21, 2022
    Inventors: Atif SYED, Enrico MASTROPAOLO, Mark James BECKWITH
  • Publication number: 20200406584
    Abstract: A flexible conductive or electronic device comprising a polymer base, a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer and a conductive layer which is bonded to the poly-para-xylylene layer by a second adhesive layer.
    Type: Application
    Filed: November 27, 2018
    Publication date: December 31, 2020
    Inventors: Atif SYED, Enrico MASTROPAOLO