Abstract: A two-part polymerizable formulation that upon mixing includes a saturated aliphatic polyester prepolymer present in an amount of between 10 to 65 weight percent of the total formulation having a viscosity of between 100 and 955 cP at 25° C. An organic solvent is present in an amount of between 25 to 55 weight percent of the total formulation. An additive of hexamethylene diisocyanate trimer, isophorone diisocyanate dimer or trimer, toluene diisocyanate or methylene diphenyl diisocyanate, or combinations thereof is present in an amount of 17 to 25 weight percent of the total formulation. A process of forming a polymerized coating on an article includes the application of the formulation to a substrate of the article. After allowing sufficient time and temperature for solvent to evaporate to accelerate a rate of cure of the polymerizable compound to form a polymerized coating on the article.

Abstract: A one part, storage stable polymerizable formulation includes a monomeric or oligomeric ethylenically unsaturated polymerizable compound that is at least one of methacrylate esters of polyethylene glycols, 1,6-hexane diol, or polypropylene glycol, 1,3- and 1,4-butylene glycol trimethylol propane trimethacrylate, or ethoxylated bisphenol A dimethacrylate. A second polymerizable compound includes dicyclopentadiene modified oligomers. An organic solvent is present and provides storage stability and upon evaporation of the solvent, a rate of polymerization of the compound accelerates independent of addition of a second part. An alkyd is present that includes an unsaturated fatty acid. An optional additive of at least one of a transition metal cure accelerator, a filler, a plasticizer, a colorant, and a cure inhibitor is present. The formulation is at least 30 total weight percent solids. A process of forming a polymerized coating on an article is also provided.

Abstract: A hydrophobic silicone coating composition includes a trialkoxysilane with trialkoxy functionality, a polyfluorinated trialkoxysilane, and an organometallic cure catalyst. A coating on a substrate is provided that includes a cured film produced by the cure of the coating composition. The coating has a contact angle of at least 93 degrees after 500 hours of exposure to UV-A exposure in ASTM D 4329 QUV using UVA 340 bulbs, cycle B exposure of alternate cycles of UV exposure and condensing humidity all at elevated temperature.

Abstract: A one part, storage stable polymerizable formulation includes a monomeric or oligomeric ethylenically unsaturated polymerizable compound that is at least one of methacrylate esters of polyethylene glycols, 1,6-hexane diol, or polypropylene glycol, 1,3- and 1,4-butylene glycol trimethylol propane trimethacrylate, or ethoxylated bisphenol A dimethacrylate. A second polymerizable compound includes dicyclopentadiene modified oligomers. An organic solvent is present and provides storage stability and upon evaporation of the solvent, a rate of polymerization of the compound accelerates independent of addition of a second part. An alkyd is present that includes an unsaturated fatty acid. An optional additive of at least one of a transition metal cure accelerator, a filler, a plasticizer, a colorant, and a cure inhibitor is present. The formulation is at least 30 total weight percent solids. A process of forming a polymerized coating on an article is also provided.

Abstract: A conductive substance for the promotion of adhesion of liquid and powder coatings to non-conductive substrates is provided that includes a solvent. A chlorinated polyolefin dispersed is dispersed in the solvent along with conductive nanoparticulate. A process of applying a conductive adhesion promoter to a non-conductive substrate is also provided that includes the application of this conductive adhesion promoter to a non-conductive substrate. The surface resistivity the substrate with a cured, dried film of the conductive adhesion promotor is less than 106 Ohm/Square. The conductive adhesion promotor cures and dries at an ambient temperature of 20° C. (1 atm) in 3-8 minutes. A dried film on a non-conductive substrate is also provided that has a cured matrix of chlorinated polyolefin in which conductive particulate is dispersed.

Abstract: A hydrophobic silicone coating composition includes a trialkoxysilane with trialkoxy functionality, a polyfluorinated trialkoxysilane, and an organometallic cure catalyst. A coating on a substrate is provided that includes a cured film produced by the cure of the coating composition. The coating has a contact angle of at least 93 degrees after 500 hours of exposure to UV-A exposure in ASTM D 4329 QUV using UVA 340 bulbs, cycle B exposure of alternate cycles of UV exposure and condensing humidity all at elevated temperature.