Patents by Inventor Atsuhi Ajioka

Atsuhi Ajioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7978031
    Abstract: The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC in an inner layer of the multilayered substrate, and coupling-reducing ground vias disposed between the first filter and the second filter. At least the first filter is disposed substantially directly below the power amplifier IC. The coupling-reducing ground vias double as thermal vias for dissipating heat generated by the power amplifier IC.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: July 12, 2011
    Assignee: TDK Corporation
    Inventors: Tomoyuki Goi, Takuya Adachi, Atsuhi Ajioka, Hitoshi Hachiga
  • Publication number: 20090195334
    Abstract: The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC in an inner layer of the multilayered substrate, and coupling-reducing ground vias disposed between the first filter and the second filter. At least the first filter is disposed substantially directly below the power amplifier IC. The coupling-reducing ground vias double as thermal vias for dissipating heat generated by the power amplifier IC.
    Type: Application
    Filed: January 14, 2009
    Publication date: August 6, 2009
    Applicant: TDK Corporation
    Inventors: Tomoyuki GOI, Takuya Adachi, Atsuhi Ajioka, Hitoshi Hachiga